Mechanical Properties of SPD (Severe Plastic Deformation) Processed Copper

Abstract

The mechanical behavior of nano grain-sized pure copper produced by various SPD (severe plastic deformation) processes such as ECAP (equal channel angular pressing) and ARB (accumulated roll bonding) was investigated in relation to the microstructural evolution. These processes promoted the formation of equiaxed nanoscale grains in pure copper. The present observation suggested that the tensile behavior of the specimens prepared by the current SPD processes was influenced by several mechanisms involving strain hardening and dynamic recovery. The heat flow was measured by using a DSC (differential scanning calorimeter) to elucidate the relationship between the dislocation density and the tensile behavior in the specimens.

Effect of PTCAP Passes on the Mechanical Properties of Copper Tubes

“…Grain size refining by PTCAP processing leads to the increase of hardness, which in turn increases the wear resistance [31,32].…”

Effect of grain size changes on corrosion behavior of copper produced by accumulative roll bonding process

“…The average grain size of these recrystallized grains is below 100 nm, smaller than that after 4 cycles. The mean grain size of pure copper fabricated by ARB process has been reported about 260-300 nm by other researchers 11,27,28 . Also the SAD pattern became more ring-like with increasing strain up to 8 cycles, indicating the increment of a portion of high angle boundary.…”

Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper

“…However, for those metals or alloys with medium to low SFE, pure Cu for example, NL structure can hardly be detected except for the localized regions in the shear bands [14]. Experimental observations show that laminated structure can be induced in Cu by severe plastic deformation (SPD), such as accumulative roll bonding (ARB) [15][16][17] and equal channel angular pressing (ECAP) [17,18]. Nevertheless, the boundary spacing between lamellae is usually as large as 200-300 nm, which is corresponding to the critical grain size for dislocation storage [19].…”