Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles

Zhang, Y.; Tao, Nengguo; Lu, K.

doi:10.1016/j.actamat.2008.01.030

Cited by 225 publications

(103 citation statements)

References 45 publications

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“…Under heat treatment to only $10% of the melting temperature, the grain size of nc Cu doubles. 45 Several studies have reported both strain relaxation and grain growth for pure, nanocrystalline copper between 100°C and 225°C [32][33][34][35][36][37][38][39]45 ($10-20% T m ). Thus, maturing the technology to enable thermal stability in nanocrystalline materials must be realized if steps are to be made toward largescale applications.…”

Section: Advantages: Grain Refinement Mechanismmentioning

confidence: 99%

“…34,35 Extended solid solubility. The mechanisms for extended solid solubility include the following: (I) the driving force due to the stored energy in grain boundaries, 36 (II) the negative heat of mixing of multicomponent systems due to high oxygen content in the milling process, 37 (III) the fragments with small tip radii are formed during milling-induced deformation such that the capillary pressure forces the atoms at the tips of fragments to dissolve, 38 (IV) the high dislocation density regions act as diffusion paths, 39 and/or (V) the energetic contribution of the phase interfaces enhance the free energy of the composite above that of the solid solution, thus providing the driving force for alloying. 40 Disadvantage: The Need for Thermal Stability…”

Section: Advantages: Grain Refinement Mechanismmentioning

confidence: 99%

See 1 more Smart Citation

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

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It is a new beginning for innovative fundamental and applied science in nanocrystalline materials. Many of the processing and consolidation challenges that have haunted nanocrystalline materials are now more fully understood, opening the doors for bulk nanocrystalline materials and parts to be produced. While challenges remain, recent advances in experimental, computational, and theoretical capability have allowed for bulk specimens that have heretofore been pursued only on a limited basis. This article discusses the methodology for synthesis and consolidation of bulk nanocrystalline materials using mechanical alloying, the alloy development and synthesis process for stabilizing these materials at elevated temperatures, and the physical and mechanical properties of nanocrystalline materials with a focus throughout on nanocrystalline copper and a nanocrystalline Cu-Ta system, consolidated via equal channel angular extrusion, with properties rivaling that of nanocrystalline pure Ta. Moreover, modeling and simulation approaches as well as experimental results for grain growth, grain boundary processes, and deformation mechanisms in nanocrystalline copper are briefly reviewed and discussed. Integrating experiments and computational materials science for synthesizing bulk nanocrystalline materials can bring about the next generation of ultrahigh strength materials for defense and energy applications.

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Section: Advantages: Grain Refinement Mechanismmentioning

confidence: 99%

Section: Advantages: Grain Refinement Mechanismmentioning

confidence: 99%

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Tschopp

Murdoch

Kecskes

et al. 2014

JOM

View full text Add to dashboard Cite

show abstract

“…In recent years, among researchers a growing interest in twinning in metals at the nanoscale is observed [7,8]. The main reason for this interest is the experimental evidence that the strength of the materials increases with increasing density of twin boundaries.…”

Section: Introductionmentioning

confidence: 99%

“…Twin boundaries affect the strength as well as the conventional grain boundaries, even at nanoscale thicknesses of twins. In addition, the grain refinement to the nano regime may occur by fragmentation of nanoscale twins [9,10]. It was shown that the dynamic plastic deformation at low temperatures in alloys with a low SFE promotes the formation of high density of nanoscale twins [11,12].…”

Section: Introductionmentioning

confidence: 99%

Effect of the stacking fault energy on the mechanical properties of pure Cu and Cu-Al alloys subjected to severe plastic deformation

2017

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Abstract. The effect of stacking fault energy (SFE) on the mechanical properties of pure Cu and alloys of Cu-2.2%Al and Cu-4.5%Al subjected to severe plastic deformation (SPD) was investigated. SPD was performed by equal channel angular pressing (ECAP) at room and cryogenic temperatures. It is established that the increase in the weight concentration of Al in the Cu matrix (a reduction of SFE) and decreasing the ECAP temperature leads to an increase of the strength characteristics. The observed tendency is caused by increasing of the role of deformation twinning.

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“…Such expectation has been realized through the emergence of several strategies in recent decades, such as, solid solution alloying, nanoprecipitate dispersion, transformation and twining-induced plasticity, engineering coherent twin boundaries (TBs) at the nanoscale, bimodal grain size distribution and gradient grained structure [1][2][3][4][5][6][7][8][9][10][11]. Recently, using low-temperature and high-rate severe plastic deformation and subsequent intercritical annealing, a novel strategy for strengthening austenitic steels or copper was introduced [12][13][14][15]. In this hierarchical structure, coarse or ultra-fine grains embedded with remaining nanotwinned (NT) regions are formed.…”

Section: Introductionmentioning

confidence: 99%

Tensile deformation mechanisms of the hierarchical structure consisting of both twin-free grains and nanotwinned grains

Yuan

Chen

2014

Philosophical Magazine Letters

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A series of large-scale molecular dynamics simulations have been performed to investigate the tensile properties and atomistic deformation mechanisms for the nanostructured Cu with three typical microstructures: the hierarchical structure consisting of both twin-free grains (d = 70 nm) and grains with bundles of smaller nanotwins (d = 70 nm, λ = 10 nm), the fully nanograined structure and the fully nanotwinned structure. The average flow stress of the hierarchically structure is found to be higher than that calculated by rule of mixture. As compared with that of fully nanograined structure, the strength for the twin-free grains in the hierarchical structure is promoted and gives extra hardening due to the increased dislocation density and dislocation behaviours. It is also found that the nanotwin bundles are more deformable than the twin-free grains in the hierarchical structure according to the deviatoric strain invariant contour. This indicates that the fully nanograined structure cannot only be strengthened to a higher level, but also obtain better ductility by embedded with stronger bundles of smaller nanotwins. Thus, a superior strength-ductility synergy could be obtained in this kind of hierarchical structures, and this novel strategy has also been implemented in bulk austenitic steels or copper by recent experiments.

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Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles

Cited by 225 publications

References 45 publications

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

Effect of the stacking fault energy on the mechanical properties of pure Cu and Cu-Al alloys subjected to severe plastic deformation

Tensile deformation mechanisms of the hierarchical structure consisting of both twin-free grains and nanotwinned grains

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