2022
DOI: 10.1007/s11666-022-01412-1
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Mechanical Properties and Residual Stress Depth Profiles of Plasma Sprayed Ceramic Coatings Deposited Under Comparable Particle Temperature and Velocity

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Cited by 5 publications
(4 citation statements)
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“…On the other hand, higher plasma power associated with alumina and chromia coatings (Table 2) resulted in the full relaxation of residual stress in the corresponding substrates (Figure 2A,C). These results were also discussed in more detail in previous reports 25,32 . The obtained residual stress profiles in top coatings are quite in line with the profiles reported in the literature.…”
Section: Resultssupporting
confidence: 91%
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“…On the other hand, higher plasma power associated with alumina and chromia coatings (Table 2) resulted in the full relaxation of residual stress in the corresponding substrates (Figure 2A,C). These results were also discussed in more detail in previous reports 25,32 . The obtained residual stress profiles in top coatings are quite in line with the profiles reported in the literature.…”
Section: Resultssupporting
confidence: 91%
“…These results were also discussed in more detail in previous reports. 25,32 The obtained residual stress profiles in top coatings are quite in line with the profiles reported in the literature. The observed trend of residual stress tending toward compression is similar to that obtained using numerical simulation by Zhu et al 33 in YSZ coating and Liu et al 34 in alumina coating.…”
Section: Full Residual Stress-depth Profilessupporting
confidence: 89%
“…This might be attributed to the residual stress originating in the high temperature gradients between the coating and substrate. Rapid cooling of particles generates quenching stress due to constrained volume change [23]. In addition, thermal stress arises from a mismatch between TEC of substrate and coating [24].…”
Section: Microstructural Analysismentioning
confidence: 99%
“…In addition, thermal stress arises from a mismatch between TEC of substrate and coating [24]. When a critical stress level is reached, it is expected that vertical cracks are formed as a relaxation mechanism [23,25]. From the optical micrographs, no oxidation layer between Cu and Al 2 O 3 is detectable.…”
Section: Microstructural Analysismentioning
confidence: 99%