Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder

Nagano, Makoto; Hidaka, Noboru; Shimoda, Masayoshi; Ono, Masahiro

doi:10.5104/jiep.8.495

Cited by 8 publications

(10 citation statements)

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“…1,2) Among lead-free solders, ternary Sn-Ag-Cu solders [3][4][5][6][7][8][9][10][11] are expected to be the substitute of a Sn-Pb eutectic solder, and have become wide spread in the manufacture of many electronic devices. However, the advanced lead-free solder, which has higher reliability than ternary Sn-Ag-Cu solders, is required to be used for various industry machines.…”

Section: Introductionmentioning

confidence: 99%

“…A supplement of a small amount of Ge in the lead-free solder is effective to depress the oxidation of the solder in soldering. 1) Moreover, a supplement of a small amount of Ni is expected to refine matrix phases formed in the solder 2) and the microstructure with such matrix phases is expected to be relatively stable under heat exposure conditions. Although mechanical properties and microstructures of the Sn-Ag-Cu-Ni-Ge lead-free solder have been examined, 2,12) the researches on the reliability of the solder joint with the Sn-Ag-Cu-Ni-Ge solder are little.…”

Section: Introductionmentioning

confidence: 99%

“…1) Moreover, a supplement of a small amount of Ni is expected to refine matrix phases formed in the solder 2) and the microstructure with such matrix phases is expected to be relatively stable under heat exposure conditions. Although mechanical properties and microstructures of the Sn-Ag-Cu-Ni-Ge lead-free solder have been examined, 2,12) the researches on the reliability of the solder joint with the Sn-Ag-Cu-Ni-Ge solder are little. Thus, the purpose of this study is to investigate the reliability of the solder ball joint with the SnAg-Cu-Ni-Ge solder under heat exposure conditions.…”

Section: Introductionmentioning

confidence: 99%

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Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions

et al. 2005

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The reliability of a solder ball joint with a Sn-Ag-Cu-Ni-Ge lead-free alloy, which is expected to be an advanced lead-free solder, was investigated under heat exposure conditions. Solder ball joints with a eutectic Sn-Ag alloy and a ternary Sn-Ag-Cu alloy were also prepared to compare with that of the Sn-Ag-Cu-Ni-Ge alloy. Microstructual observations of the cross sections of the solder ball joints were conducted to investigate microstructural evolutions in the solders and the growth kinetics of reaction layers formed at joint interfaces. The influence of heat exposure treatment on joint strength was investigated by ball shear test. Moreover, the influence of surface treatment of a Cu pad on the reliability of the solder joint was also investigated.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions

et al. 2005

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“…1,2) A supplement of a small amount of Ge in a Sn-Ag-Cu lead-free solder is effective to depress the oxidation of the solder in soldering. 1) Moreover, a supplement of a small amount of Ni in the SnAg-Cu solder is expected to refine matrix phases formed in the solder and the microstructure with such matrix phases is expected to be relatively stable under heat exposure conditions.…”

Section: Introductionmentioning

confidence: 99%

“…2) Although mechanical properties and microstructures of the Sn-Ag-Cu-Ni-Ge lead-free solder have been examined, 2,3) the researches on the reliability of the Sn-AgCu-Ni-Ge solder joints are a little.…”

Section: Introductionmentioning

confidence: 99%

Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

et al. 2008

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The impact properties of solder ball joints with Sn-Ag-Cu-Ni-Ge lead-free solders and Cu electrodes were investigated in the aged conditions at 393 K. The impact properties evaluated was compared with Sn-Ag and Sn-Ag-Cu solder joints. The impact properties of Sn-AgCu-Ni-Ge joints were superior to those of Sn-Ag and Sn-Ag-Cu joints. In the cases of Sn-Ag and Sn-Ag-Cu joints, fracture mainly occurred in the intermetallic compounds (IMC) layer formed in the joint interface regardless of aging treatment. On the contrary, main fracture mode was solder fracture in as-reflow Sn-Ag-Cu-Ni-Ge joints. Although the main fracture mode gradually changed from solder fracture to IMC fracture upon aging, Sn-Ag-Cu-Ni-Ge joints had excellent impact reliability compared with Sn-Ag and Sn-Ag-Cu joints even after aging at 393 K for 1000 h.

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Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

Hidaka

Watanabe

Yoshiba

2009

Journal of Elec Materi

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We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni) 6 Sn 5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

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Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder

Cited by 8 publications

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Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions

Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions

Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

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Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder

Cited by 8 publications

References 0 publications

Reliability of Solder Joint with Sn&ndash;Ag&ndash;Cu&ndash;Ni&ndash;Ge Lead-Free Alloy under Heat Exposure Conditions

Reliability of Solder Joint with Sn&ndash;Ag&ndash;Cu&ndash;Ni&ndash;Ge Lead-Free Alloy under Heat Exposure Conditions

Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

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Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions

Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions