Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion

Cobos, Oscar Fabián Higuera; Cabrera, J.M.

doi:10.1016/j.msea.2013.01.076

Cited by 114 publications

(68 citation statements)

References 39 publications

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“…Nevertheless, the final grain size was larger than for the ECAP route B C [35], which yields an average grain size of below 500 nm for the applied strain of 13.2. Also, in the ECAP process with 16 passes using the route B C , the grain size was estimated to be 0.49 µm [26].…”

Section: Microstructurementioning

confidence: 99%

“…This phenomenon has been widely described for pure copper processed using various SPD methods, such us high pressure torsion (HPT) [21][22][23], accumulative roll bonding (ARB) [24] or different types of ECAP [25][26][27][28]. However, grain refinement also affects functional properties such as corrosion resistance and electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

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The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

2017

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Samples of electrolytic tough pitch copper were deformed in equal channel angular pressing with enhanced productivity to quickly refine its initial coarsegrained microstructure at room temperature. The evolution in microstructure and changes in a broad range of properties were compared to a sample in the undeformed state. The microstructure evolution was evaluated using electron backscatter diffraction for both states and transmission electron microscopy for a detailed microstructure characterization of the deformed sample. The microstructure observations were correlated with the results of tensile tests, electrochemical tests in 3.5 wt% NaCl, electrical conductivity measurements and thermal stability up to 200°C. The ECAP process employed in this study caused a grain refinement from about 16 µm to about 600 nm. The microstructure refinement caused a 50% increase in both the YS and UTS. The elongation to failure, due to the high amount of LAGBs, maintained a high value of 13.3%. The corrosion and pitting potentials were higher for the deformed sample. Furthermore, the grain refinement caused a decrease in electrical conductivity from 100.2% IACS to 93.1% IACS, a drop of 7% IACS. The deformed sample displayed thermal stability up to a temperature of 175°C, where there was a drop in micro-hardness of more than 10%.

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Section: Microstructurementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

2017

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“…Previous studies have shown that inducing grain refinement in copper by applying severe plastic deformation can lead to improvements in mechanical properties [1,2]. In samples of commercially pure copper processed by equal-channel angular pressing (ECAP), it was shown that electrical conductivity decreases slightly with an increase in the number of passes [3]. That study also demonstrated that yield strength, ultimate tensile stress, and hardness gradually increased with the number of ECAP passes.…”

Section: Introductionmentioning

confidence: 88%

Prediction of grain deformation in drawn copper wire

Chang

Wang

Huang

et al. 2015

MATEC Web of Conferences

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Abstract. Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copper wire based on finite element simulation with flow net analysis. Simple upsetting tests were conducted to obtain flow stress curves for the simulation of the drawing process. Predictions related to grain deformation were compared with those on the micrographs of the drawn copper wire obtained in experiments. In longitudinal and transverse cross-sections of the drawn wire, the predicted and experiment results presented similar trends involving considerable deformation within the grains. This preliminary study demonstrates the efficacy of the proposed method in providing information useful to the prediction of the grain deformation in drawn copper wire.

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“…Deformation band dalam Gambar 9(a) -9(b) dan Gambar 11(a)-11(b) merupakan struktur yang terbentuk karena regangan yang besar [15][16][17][18][19][20] . Garis-garis yang muncul tersebut nantinya akan berkembang menjadi shear band apabila deformasi warm rolling dilakukan pada % reduksi yang lebih tinggi lagi.…”

Section: Hasil Dan Diskusiunclassified

Pengaruh Anneal Hardening Dan % Reduksi Warm Rolling Terhadap Sifat Mekanik Paduan Cu-Zn 70/30 [Influence of Anneal Hardening And Warm Rolling % Reduction To Mechanical Properties of Cu-Zn 70/30]

Febriyanti¹,

Priadi²,

Riastuti³

2016

metal.

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IntisariPaduan tembaga memiliki banyak kegunaan dalam bidang industri. Namun, dalam aplikasinya membutuhkan sifat mekanis yang tinggi. Oleh karena paduan tembaga sulit dilakukan pengerasan secara konvensional seperti alloying, precipitation hardening, dan dispersion hardening maka yang dilakukan adalah dengan mekanisme anneal hardening melalui proses anil pada suhu 150-300 °C. Pada penelitian ini, paduan Cu-Zn 70/30 dilakukan warm rolling pada suhu 300 °C dengan presentase reduksi 50% dan 60%. Karakterisasi yang dilakukan setelah proses di atas adalah uji kekerasan secara mikro, uji tarik, pengamatan metalografi, dan analisa dengan FESEM (field emission scanning electron microscope). Hasil pemeriksaan menunjukkan bahwa efek anneal hardening muncul pada suhu 300 °C yang diikuti dengan peningkatan nilai kekerasan dan kekuatan tarik, namun persen elongasinya menurun. Dengan semakin besarnya % reduksi warm rolling diikuti dengan proses anneal yang dilakukan terhadap paduan Cu-Zn 70/30 mengakibatkan terjadinya anneal hardening. Hal ini disebabkan karena adanya unsur Zn yang tersegregasi dalam dislokasi dan teramati dengan FESEM sebagai pita-pita deformasi (deformation band). Dengan meningkatnya % reduksi yang diberikan pada paduan juga akan menghasilkan pita-pita deformasi yang semakin rapat dan tebal.

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Mechanical, microstructural and electrical evolution of commercially pure copper processed by equal channel angular extrusion

Cited by 114 publications

References 39 publications

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

Prediction of grain deformation in drawn copper wire

Pengaruh Anneal Hardening Dan % Reduksi Warm Rolling Terhadap Sifat Mekanik Paduan Cu-Zn 70/30 [Influence of Anneal Hardening And Warm Rolling % Reduction To Mechanical Properties of Cu-Zn 70/30]

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