Mechanical fatigue of thin copper foil

Merchant, H. D.; Minor, M. G.; Liu, Y. L.

doi:10.1007/s11664-999-0176-x

Cited by 70 publications

(35 citation statements)

References 6 publications

(5 reference statements)

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“…If the plastic strain per cycle e pl is plotted against the number of cycles N, the slope of the curve corresponds to the Coffin-Manson exponent c. In this study a value of À0.3 ± 0.1 was obtained for both sets of samples. This value is lower than the reported value of À0.6 for bulk Cu [39], but is in good accordance with c = À0.43 measured in strain-controlled flex fatigue experiments reported by Merchant and Minor [40], where 12-35 lm thin electrodeposited Cu foils were bent/unbent around a mandrel, as described in Refs. [41,42].…”

Section: Resultssupporting

confidence: 91%

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

et al. 2015

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Section: Resultssupporting

confidence: 91%

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

et al. 2015

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“…5) was used to analyze the scattering in fatigue crack growth. Substituting the Klesnil-Lukas function (10) to the Ortiz's stochastic model (12), log Z was obtained by each experimental data as follows:…”

Section: Scattering On Fatigue Crack Growthmentioning

confidence: 99%

“…While most studies about fatigue in thin metal have focused on stress-life (S-N) and strain-life (ε-N) curves for reliability of microelectronic products, [12][13][14] the fatigue crack growth behavior under strain-controlled testing has not been enough explored in detail. In our past research, it has been shown that electrodeposited copper (ED-Cu) with fine-grained microstructure (~ 2 μm) offers stable crack propagations and the scattering in the crack growth rate was enough small to estimate cyclic numbers.…”

Section: Introductionmentioning

confidence: 99%

Effect of Specimen Shape on Fatigue Behavior in Thin Pure Copper Sheet for Smart Stress-memory Patch

Shiraiwa

Enoki

2014

ISIJ Int.

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Smart stress-memory patch is a promising method for monitoring long-term fatigue damage in structure. The patch can estimate the number of cycles and the stress amplitude using fatigue crack growth properties of thin metal sheets. In this study, fatigue crack growth behavior of thin pure copper sheet was investigated by changing the specimen shape under strain-controlled testing in order to improve measuring range of smart stress-memory patch. To characterize the initiation as well as the stable growth of fatigue cracks, the relationship between stress intensity factor range and crack growth rate was successfully fitted to one equation regardless of strain amplitude, strain ratio and specimen shape. Based on the experimental results, an equation for estimating fatigue cycles from fatigue crack length was derived. In addition, the detectable range of stress amplitude was evaluated and its dependence on sensor shape and stress ratio was shown. Since this patch needs neither power supply nor wiring, it provides a great potential for long-term structural health monitoring with easy maintenance.

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“…Especially, a long-term sensing method of fatigue damage is very important to avoid the fracture caused by cyclic loading. Strain gauge, FBG (Fiber Bragg Grating) sensor 13) and wireless strain sensing systems 46) are utilized to monitor strain and to evaluate fatigue damage. However, there are several problems on the practical use such as necessity of wiring, electrical power supply and complicated measuring devices.…”

Section: Introductionmentioning

confidence: 99%

Strain-Controlled Fatigue Behavior in Thin Pure Copper Sheet for Smart Stress-Memory Patch

Shiraiwa

Enoki

2012

Mater. Trans.

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A new sensing method called "smart stress-memory patch" has been proposed for fatigue damage evaluation of structures. This patch estimates the number of cycles and stress amplitude using its crack length. In this study, fatigue crack growth behavior in thin pure copper sheet was investigated under strain-controlled testing to evaluate the sensor characteristics when the patch is attached to structure. Electrodeposited (ED) copper of 99.96% purity with an average grain size of 2 µm provided a stable crack propagation and easy observation of crack length. The relationship between stress intensity factor range and crack growth rate was fitted on one curve regardless of strain amplitude. The scattering in fatigue crack growth was evaluated by a stochastic model, and it demonstrated that the error of fatigue cycles estimated by the patch is small enough. Furthermore, stress transfer between the patch and structure was calculated on the simple assumption that the patch is perfectly bonded on the structure, and it was shown that the patch attached to structure can estimate the number of cycles and stress amplitude on the structures.

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Mechanical fatigue of thin copper foil

Cited by 70 publications

References 6 publications

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

Effect of Specimen Shape on Fatigue Behavior in Thin Pure Copper Sheet for Smart Stress-memory Patch

Strain-Controlled Fatigue Behavior in Thin Pure Copper Sheet for Smart Stress-Memory Patch

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