Mechanical failures of Two-Dimensional materials on polymer substrates

Chae, Kwanbyung; Nguyen, Van Tu; Lee, Sangryun; Phung, Thi Quynh; Sim, Yumin; Seong, Maeng-Je; Lee, Sangwoon; Ahn, Y. H.; Lee, Soonil; Validataion, Seunghwa Ryu; Park, Jiyong

doi:10.1016/j.apsusc.2022.154736

Cited by 3 publications

(3 citation statements)

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“…[10] This occurs because of the thin film/polymer system with a significant mismatch in elastic moduli, where WS 2 is much stiffer (≈302.4 GPa) than the polymer substrate (2-4 GPa). [44,45] During the pick-up process, the Poisson's effect induces tensile strain which easily results in mud-cracking in the vdW films due to the large moduli mismatch. The positions of the cracks are marked as dotted lines as a guide to the eyes.…”

Section: Resultsmentioning

confidence: 99%

Mesoscopic Stacking Reconfigurations in Stacked van der Waals Film

Heo,

Kim,

Lee

et al. 2023

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Mesoscopic‐scale stacking reconfigurations are investigated when van der Waals (vdW) films are stacked. A method to visualize complicated stacking structures and mechanical distortions simultaneously in stacked atom‐thick films using Raman spectroscopy is developed. In the rigid limit, it is found that the distortions originate from the transfer process, which can be understood through thin film mechanics with a large elastic property mismatch. In contrast, with atomic corrugations, the in‐plane strain fields are more closely correlated with the stacking configuration, highlighting the impact of atomic reconstructions on the mesoscopic scale. It is discovered that the grain boundaries do not have a significant effect while the cracks are causing inhomogeneous strain in stacked polycrystalline films. This result contributes to understanding the local variation of emerging properties from moiré structures and advancing the reliability of stacked vdW material fabrication.

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Section: Resultsmentioning

confidence: 99%

Mesoscopic Stacking Reconfigurations in Stacked van der Waals Film

Heo,

Kim,

Lee

et al. 2023

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“…Tangential interfacial interactions between the 2D material, polymeric substrate and capping layer are crucial to enable controlled fragmentation and determine the resulting fragment size. Interfacial behaviors of shearing, 16,17 slippage, 17,18 cracking 19,20 and pullout to damage 21,22 between 2D materials and different matrices have been widely investigated through experiment, theoretical modeling, finite element (FE) and atomistic simulations. The loading conditions to induce interfacial deformation include uniaxial 17 and biaxial 19 tensions, lap shearing 20 and bending.…”

Section: Introductionmentioning

confidence: 99%

“…Interfacial behaviors of shearing, 16,17 slippage, 17,18 cracking 19,20 and pullout to damage 21,22 between 2D materials and different matrices have been widely investigated through experiment, theoretical modeling, finite element (FE) and atomistic simulations. The loading conditions to induce interfacial deformation include uniaxial 17 and biaxial 19 tensions, lap shearing 20 and bending. 16,18 However, most research on strain engineering and interfacial failure of 2D materials focuses on a single type of interface which is between the 2D material and substrate.…”

Section: Introductionmentioning

confidence: 99%