2018
DOI: 10.1016/j.actamat.2018.08.046
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Mechanical failure of CrN/Cu/CrN interfacial regions under tensile loading

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Cited by 22 publications
(7 citation statements)
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“…Therefore, only a brief description of the model formulation is given below. The present authors have utilized this model to analyze the tensile deformation characteristics of nanoscale metal adhesion layers sandwiched between ceramic layers [38].…”
Section: (F))mentioning
confidence: 99%
See 1 more Smart Citation
“…Therefore, only a brief description of the model formulation is given below. The present authors have utilized this model to analyze the tensile deformation characteristics of nanoscale metal adhesion layers sandwiched between ceramic layers [38].…”
Section: (F))mentioning
confidence: 99%
“…where and h 0 is the initial strain hardening rate, due to dislocation accumulations. To calibrate the associated kinematic constants for single crystal Al, material point simulations comprising 500 grains using mean field assumptions were performed [33,38]. The calibrated constants, along with the elastic constants of Al, are shown in the TSL OIM software.…”
Section: (F))mentioning
confidence: 99%
“…Composite coating design and multilayer coating architecture are two useful strategies in tailoring coating stress profile inside the coating, improving coating toughness, and enhancing coating adhesion strength to the substrate 12–17 . And these properties could be more prominent when coating is composed of materials with dissimilar characteristic, such as hard ceramics and ductile metals 18–20 . Comparing with other metals, Nickel (Ni) has good ductility, antioxidation, and high corrosion resistance 21,22 .…”
Section: Introductionmentioning
confidence: 99%
“…Among various wearable strain sensors, nano-metal films were frequently applied as the sensitive component in the sensor due to their excellent electrical conductivity and ductility [15]. However, external stresses can easily lead to the initiation of cracking in the surface of metal films, which results in a loss of durability, stability, and sensitivity for the device [16,17]. To solve the problem of circuit breaking caused by metal cracks, metal nanowires spin-coated on the polymer substrates were used instead of a deposited metal film [18,19].…”
Section: Introductionmentioning
confidence: 99%