Mechanical durability of screen-printed flexible silver traces for wearable devices

Positive and Negative Changes in the Electrical Conductance Related to Hybrid Filler Distribution Gradient in Composite Flexible Thermoelectric Films Subjected to Bending

“…However, quite a limited amount of research attention is paid to the study of the resistance response of the electrically conductive thin films to both compression and tension during the bending. Up to date, most of such studies were devoted to the durability of silver paint electrodes deposited on polymer substrates for wearable electronics [ 14 , 15 ], silver networks covered by polymer for flexible thin film heaters [ 16 ], and flexible metal oxide electrodes on polymer substrates for touch-screen panels [ 17 ] and flexible OLED applications [ 18 ]. In most of these works, the resistance measurements were applied to determine the limits for mechanical bending and durability.…”

“…In most of these works, the resistance measurements were applied to determine the limits for mechanical bending and durability. Some of the works report the difference between the electrical conductance change (commonly increase from the value of not bent sample) in respect to the bending direction (inner/outer), when approaching critical bending radius [ 14 , 18 ]. However, almost no attention is paid to the analysis of mechanisms underlying these changes in the electrical conductance of the samples.…”

Perforated PVP encapsulated AgNWs for high mass loading in silver nanowire inks for printed RFID integrated wearable smart bands

“…1 Conductive inks that maintain conductivity under extreme bending/folding conditions lie at the center of this transformative technology. [2][3][4] Due to their unique properties, one-dimensional nanostructures, particularly metallic nanowires, are gaining considerable attention for formulating conductive inks. 5 The quasi-one-dimensional nature of nanowires offers an extremely high aspect ratio, making them capable of exhibiting remarkable properties, such as high conductivity, flexibility, and packing density, compared to other nanostructures.…”

A novel approach to improve reliability of aerosol jet printing process

“…Printed flexible electronics (PFE) was developed to overcome the limitation of rigid and brittle traditional electronics by the use of elastic materials to fabricate electronic circuits that can be stretched or bent without breaking while still maintaining desired electronic properties. This technology is being used in a wide range of applications, including smart packaging, sensors [8], displays, and energy harvesting [60], [33], that are lightweight, low cost, and can be easily integrated into a range of electronic devices. The manufacture of flexible, stretchable, wearable, and conformal electronic components is possible due to several conventional, 3D, and hybrid printing technologies, where the most popular are: (i) inkjet printing [20], [2], (ii) aerosol jet printing [12], [58], (iii) screen printing [37], [68], (iv) gravure printing [48], [47], or (v) stereolithography [38], [39].…”