Mechanical Characterization of Polysilicon Through On-Chip Tensile Tests

Corigliano, Alberto; Masi, B. De; Frangi, Alejandro F.; Comi, Claudia; Villa, Alberto; Marchi, M.

doi:10.1109/jmems.2003.823221

Cited by 124 publications

(96 citation statements)

References 18 publications

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“…At this scale, in fact, also geometric features have to be dealt with as stochastic variables, due to the possible effects of overetch. As for the film morphology, the Thelma process [2] adopted to get the moving structure leads to an average grain size of about 500 nm, with the axis of epitaxial growth (almost) perpendicular to the substrate surface, i.e. perpendicular to the plane reported in Figure 1.…”

Section: Methodsmentioning

confidence: 99%

Assessment of overetch and polysilicon film properties through on-chip tests

Mirzazadeh

Ghisi

Mariani

2015

Proceedings of 2nd International Electronic Conference on Sensors and Applications

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Due to the increasing demand of miniaturization of MEMS devices, the characteristic size (e.g. the width) of some mechanical components may become comparable to that of a silicon grain. Therefore, the relevant effective mechanical properties can vary significantly from one device to another. In this work, through on-chip tests we investigate the behavior of polysilicon films using standard electrostatic actuation/sensing. The outcomes of the experimental campaign are then compared to those obtained with an analytical reduced-order model of the moving structure, and to coupled electro-mechanical simulations accounting for the polycrystalline morphology of the silicon film. These two models are adopted to bilaterally bound the experimental data up to pull-in, and to assess the scattering induced by the random orientation of the crystal lattice of each grain in slender parts of the devices.

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Section: Methodsmentioning

confidence: 99%

Assessment of overetch and polysilicon film properties through on-chip tests

Mirzazadeh

Ghisi

Mariani

2015

Proceedings of 2nd International Electronic Conference on Sensors and Applications

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“…The main process phases are substrate thermal oxidation, deposition and patterning of horizontal interconnections, deposition and patterning of a sacrificial layer, epitaxial growth of the structural layer, structural layer patterning by trench etch and sacrificial oxide removal and contact metallization deposition (see [6] for more details). The inertial masses of the integrated structures and the proof masses of the torsional resonators have holes to allow the complete oxide removal below it.…”

Section: Fabricated Devicementioning

confidence: 99%

“…The device is fabricated by the Thelma © surface-micromachining technique [6] that makes it possible to obtain planar suspended structures with relatively small thickness, anchored to the substrate through flexible parts (springs) and M consequently able to displace with respect to the underlying silicon substrate. The proposed four-axis sensor makes use of differential resonant detection for both in-plane and out-of plane acceleration components and roll and yaw velocity components.…”

Section: Introductionmentioning

confidence: 99%

Integrated structure for a resonant micro-gyroscope and accelerometer

Zega¹,

Comi²,

Corigliano³

et al. 2014

Frattura Ed Integrità Strutturale

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ABSTRACT. This paper presents the study of the mechanical behavior of a microstructure designed to detect acceleration and angular velocity simultaneously. The new resonant micro-sensor proposed, fabricated by the ThELMA © surface-micromachining technique, bases detection of two components of external acceleration (one in-plane component and one out-of plane component) and two components of angular velocity (roll and yaw) on the variation of frequency of several elements set in resonance. The device, despite its small dimensions, provides a differential decoupled detection of four external quantities thanks to the presence of four slender beams resonating in bending and four torsional resonators.

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“…On the other side, lithography based techniques present some drawbacks, as they require sophisticated and expensive equipment operating in cleanroom facilities thus limiting customizability and flexibility. Finally, a lack of tri-dimensionality, especially in the case of surface micromachining processes (see e.g., [1]), leads the MEMS designer to deal with strict constraints during the design process of MEMS devices (e.g., accelerometers, gyroscopes). In this scenario, additive manufacturing (AM) technologies, like 3D printing, have emerged as a possible way to overcome the limitation of standard silicon micromachining processes for the production of the structures.…”

Section: Introductionmentioning

confidence: 99%

Design, Fabrication and Testing of the First 3D-Printed and Wet Metallized z-Axis Accelerometer

Credi

Zega

Bernasconi

et al. 2017

Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017

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Abstract:In this work the design, fabrication and testing of the first 3D-printed and wet metallized capacitive z-axis accelerometer with a volume of 3.4 cm × 8 mm × 2.5 mm is presented. Preliminary results well match the modelling, both in terms of electromechanical parameters and of measured sensitivity, thus validating the proposed concept and fabrication process. With a spring thickness of 300 µm and a gap size of 200 µm for capacitive read-out, the presented device and the shown results can be considered as the first step toward 3D-printed MEMS (Micro-Electro-Mechanical Systems) inertial sensors.

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Mechanical Characterization of Polysilicon Through On-Chip Tensile Tests

Cited by 124 publications

References 18 publications

Assessment of overetch and polysilicon film properties through on-chip tests

Assessment of overetch and polysilicon film properties through on-chip tests

Integrated structure for a resonant micro-gyroscope and accelerometer

Design, Fabrication and Testing of the First 3D-Printed and Wet Metallized z-Axis Accelerometer

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