2008
DOI: 10.1016/j.msea.2008.04.052
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Mechanical characterization of NiTi SMA wires using a dynamic mechanical analyzer

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Cited by 32 publications
(15 citation statements)
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References 18 publications
(22 reference statements)
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“…crack initiation, crack growth and final rupture [1]) but also to functional fatigue [2]: when an SMA that exhibits pseudo-elastic behaviour is subjected to cyclic loading, accumulation of permanent strain ensues and the critical stresses for the forward and reverse transformation decrease [2,3]. Functional fatigue has been attributed to either the accumulation of dislocations [3] or the stabilization of martensite variants [4,5] or a combination of these processes [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…crack initiation, crack growth and final rupture [1]) but also to functional fatigue [2]: when an SMA that exhibits pseudo-elastic behaviour is subjected to cyclic loading, accumulation of permanent strain ensues and the critical stresses for the forward and reverse transformation decrease [2,3]. Functional fatigue has been attributed to either the accumulation of dislocations [3] or the stabilization of martensite variants [4,5] or a combination of these processes [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…In a recent work, Roy et al [23] have investigated austenitic fatigue in thin NiTi wires which has significant two-way shape memory due to thermo-mechanical training. They show that at stress levels much higher than the critical stress for the onset of SIM ( SIM ), there is a rapid deterioration in fatigue life compared to those cycled at stresses lower than the critical stress.…”
Section: Introductionmentioning
confidence: 99%
“…These phenomena are difficult to identify by considering only stress-strain curves of superelastic tensile tests. Using Dynamical Mechanical Analysis (DMA) to study shape memory alloys is a classical method to investigate phase transformation temperatures [2,3,4,5,6,7], damping properties [8,9,10,11,12] or effect of fatigue [13]. Classically DMA tests are performed during a temperature sweep under a constant low stress; storage modulus and loss factor are measured as function of temperature.…”
Section: Introductionmentioning
confidence: 99%