Mechanical characterisation of γ-TiAl thin films obtained by two different sputtering routes

Vieira, M. Teresa; Trindade, B.; Ramos, Adriana; Fernandes, J.V.; Vieira, Manuel F.

doi:10.1016/s0921-5093(01)01550-7

Cited by 15 publications

(7 citation statements)

References 8 publications

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“…The transition between this enriched area and the rest of the interface is very diffuse, indicating that at this temperature the entire interface is composed of only one phase (g-TiAl). This conclusion is corroborated by studies [20] showing that Ti/Al multilayers with nanometric periods (less than 200 nm) heat treated at 600 C for 1 h evolve to g-TiAl; small amounts of a 2 -Ti 3 Al are found in some samples. Similar results have been obtained by Kim et al [21] whose research indicates that the crystallization of an amorphous Ti 53 Al 47 thin film starts at 500 C and g-TiAl þ a 2 -Ti 3 Al phases were formed during annealing at 600 C for 1 h. Tests at high processing temperatures and multilayers without the thicker superficial titanium layer were used trying to eliminate the porosity, lack of union and chemical heterogeneities present at the interface.…”

Section: Resultssupporting

confidence: 61%

Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as interlayers

et al. 2006

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Alternating nanometric layers of titanium and aluminium were used as filler material to promote joining between titanium aluminide samples. The improved diffusivity of these nanometric layers is thought to overcome the difficulties in solid-state joining of titanium aluminides without producing chemical discontinuities at the interface. In this study, a thin multilayer (alternating titanium and aluminium layers), 2 mm thick, was deposited by dc-magnetron sputtering onto the two surfaces to be joined. The effects of processing conditions and the thickness of nanometric layers on microstructure and chemical composition variation across the interface have been analyzed. Sound regions can be obtained at temperatures as low as 600 C but higher temperatures (800e1000 C) are needed to obtain completely sound joints. During processing, the asdeposited film evolves to a nanocrystalline TiAl layer which may explain why the bond region is slightly harder than the base material.

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Section: Resultssupporting

confidence: 61%

Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as interlayers

et al. 2006

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“…When using sputtering, titanium aluminide thin films have been manufactured by the use of different targets: (i) a target of an Al disk mounted on a Ti disk, (ii) one target of titanium and another of aluminum, (iii) the intermetallic target [130][131][132][133]. A part from the high temperature performance, the microstructure evolution [131][132][133], crystallization kinetics [133] and mechanical properties [130] have also been investigated. In some cases, a proper annealing treatment was necessary to achieve the target composition within the deposited film.…”

Section: Physical Vapor Depositionmentioning

confidence: 99%

Transition Metal Aluminide Coatings and Initial Steps on Additive Manufacturing

Luis¹

2018

Intermetallic Compounds - Formation and Applications

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During the last decades, Fe-, Ni-and Ti-based aluminides have been studied in terms of bulk materials with an effort to develop alloying and processing strategies to overcome their low ductilities and toughness compared to conventional alloys. Whenever significant improvements can be addressed in this direction, they will be opened to an extensive range of industrial applications, especially those related to high temperature resistance requirements. In parallel, progressing interest has also been focused on their application as protective layers. This chapter is intended to provide a review of the evolution that has been made mainly during the last two decades of the several coating technologies devoted for this purpose. From thick to thin coatings are revised, with insight into coating microstructures and properties as well. Lack of space has forced the selection of those technologies arising most interest within last years; therefore, the content will follow this order: joining (laser cladding and electrospark deposition), thermal spraying (high velocity oxygen fuel and cold spraying) and physical vapor deposition (magnetron sputtering and cathodic arc deposition).

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“…So far, most studies on sputter-deposited Ti/Al thin films have been focused on their mechanical properties [9,10] and the thermal stability [11,12] at relatively high temperatures. However, the inter-diffusion and defects evolution in the films are of both basic and practical importance.…”

Section: Introductionmentioning

confidence: 99%