Mechanical and Thermal Behaviour of Epoxy/Hexagonal Boron Nitride/Short Sisal Fiber Hybrid Composites

Abstract

Hybrid composite i.e. surface modified hexagonal boron nitride (hBN) and short sisal fiber reinforced in epoxy matrix is fabricated using hand lay-up method. The effect of surface modified hBN filler and sisal fiber content on mechanical and thermal properties of epoxy based hybrid composites were investigated in this paper. The main aim of the investigation is to develop a material which can found its application in microelectronic components. As per the requirement of microelectronic industry, the material should possess high thermal conductivity. Hence, thermal conductivity of epoxy increases with increase in hexagonal boron nitride content. Inspite of insulative nature of sisal fiber, the study shows that its inclusion in combination with hBN enhances the thermal conductivity if the content of both the fillers were properly selected. Other thermal property like coefficient of thermal expansion and glass transition temperature appreciably improves when combination of fillers were added in epoxy matrix. Mechanical properties under study i.e. tensile strength and compressive strength also enhances when combination of sisal fiber and hBN were incorporated as compared to when single filler hBN were used. Hence, usage of hybrid filler as reinforcement in epoxy improve overall mechanical and thermal property of the developed material.

Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

“…The issue of heat-conducting properties of h-BN based compositions has had considerable attention in several studies [16,[18][19][20][21]24,[28][29][30][31][32][42][43][44][45][46][47]54]. Unfortunately, reported values of effective thermal conductivity were insufficient (no higher than 2.0 W•m −1 •K −1 ), since composites with relatively low-filler contents were obtained.…”

“…In this respect, composites based on hexagonal boron nitride (h-BN) attract significant research interest due to their excellent dielectric properties and thermal conductivity; layered structure of h-BN provides high-and controlled property anisotropy; in addition, h-BN has superb thermal stability. The decomposition temperature of h-BN in vacuum reaches 3000 K, so respective composites are able to withstand operating temperatures limited only by decomposition temperature of the matrix material [16][17][18][19][20][21].…”

“…Epoxy resin was used as binder in most studies [16][17][18][19][22][23][24][25][30][31][32], since it is a thermoset polymer, and its bis-phenolic-based precursor (although naphthalene-type precursors were also considered [33]) has low viscosity, making the process of mixing the filler with matrix straightforward. For example, in the report by Wang et al [30], h-BN/epoxy composite films were manufactured; electrical and thermal conductivity of the obtained samples reached the values of 3.0-3.5 for dielectric constant, 10 −12 S/cm for electrical conductivity and 0.205 W•m −1 •K −1 for thermal conductivity, respectively.…”

Investigation of mechanical characteristics of coir fibre/hexagonal boron nitride reinforced polymer composite

“…Agarwal et al [35] fabricated surface-modified hexagonal boron nitride (hBN) and short sisal fibre reinforced in the epoxy matrix using the handlay-up method. The authors concluded that thermal conductivity increases with an increase in h-BN content.…”

“…PROPERTIESCoir fibre[27] h-BN[35] Density (g/cm 3 ) 1-2 1.9-2.0 Modulus (GPa) ii denotes the coefficient of a quadratic equation.…”