Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

Kumar, Sanjeev; Jung, Jae Pil

doi:10.1016/j.mseb.2012.10.003

Cited by 30 publications

(12 citation statements)

References 47 publications

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“…If the value of B/G is large, it means that the material has a good ductility, otherwise it will be characterised by prominent brittleness. For a normal material, if its B/G value exceeds 1.75, indicating it is a ductile material, otherwise it is brittle [30]. According to the data given in Table 3, the B/G value of Ni 3 Al alloy is 2.368, which is obviously higher than the critical value 1.75, demonstrating that Ni 3 Al is a ductile material which agrees with the experimental result reported in a previous study [43].…”

Section: Elastic Propertiessupporting

confidence: 88%

“…Accordingly, LDA induces smaller lattice constants, larger cohesive energies and bulk modulus. GGA introduces a dependence of exchange-correlation function on the local gradient of the electron density and typically improves the underestimation of LDA in predicting lattice constants [30]. The present work and many other works [31][32][33] show that, compared to LDA, GGA can get a higher accuracy in predicting lattice constants and elastic properties, therefore GGA was used in the following calculations.…”

Section: Lattice Constantsmentioning

confidence: 59%

“…Moreover, the bulk modulus, shear modulus and elastic modulus were calculated using the Voigt-Reuss approximation [39]. The upper limit and lower limit of the actual effective modulus correspond to Voigt bound and Reuss bound obtained by the average polycrystalline modulus based on two assumptions: uniform strain and uniform stress throughout a polycrystal, respectively [30]. For cubic lattices, Voigt bulk modulus (B V ) and shear modulus (G V ) are…”

Section: Elastic Propertiesmentioning

confidence: 99%

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The Mechanical Properties and Elastic Anisotropies of Cubic Ni3Al from First Principles Calculations

et al. 2018

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Ni3Al-based superalloys have excellent mechanical properties which have been widely used in civilian and military fields. In this study, the mechanical properties of the face-centred cubic structure Ni3Al were investigated by a first principles study based on density functional theory (DFT), and the generalized gradient approximation (GGA) was used as the exchange-correlation function. The bulk modulus, Young’s modulus, shear modulus and Poisson’s ratio of Ni3Al polycrystal were calculated by Voigt-Reuss approximation method, which are in good agreement with the existing experimental values. Moreover, directional dependences of bulk modulus, Young’s modulus, shear modulus and Poisson’s ratio of Ni3Al single crystal were explored. In addition, the thermodynamic properties (e.g., Debye temperature) of Ni3Al were investigated based on the calculated elastic constants, indicating an improved accuracy in this study, verified with a small deviation from the previous experimental value.

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Section: Elastic Propertiessupporting

confidence: 88%

Section: Lattice Constantsmentioning

confidence: 59%

Section: Elastic Propertiesmentioning

confidence: 99%

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The Mechanical Properties and Elastic Anisotropies of Cubic Ni3Al from First Principles Calculations

et al. 2018

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“…Fig. 3(a), which were considered to be Ag 3 Sn plates since Ag 3 Sn has a higher density (9.63 g/cm 3 [13]) than that of the solder (7.4 g/cm 3 ). When the solder melted, the Ag 3 Sn plates began simultaneously to dissolve into the molten solder and this process took about tens of seconds, as shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Dissolution and precipitation of Ag<inf>3</inf>Sn plates in ultra fine solder joints using synchrotron radiation real-time imaging technology

Huang

Yang

Zhao

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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With the continuous miniaturization of solder joints, the formation of large Ag 3 Sn plates in Ag containing solders has a detrimental effect on the reliability of solder joints. In the present work, synchrotron radiation real-time in situ imaging technology was used to study the dissolution and precipitation behavior of Ag 3 Sn plates, as well as the undercooling of Ag 3 Sn plates and the solder balls, in Sn-4.0Ag-0.5Cu/Ni-P solder joints with a diameter of 45 m. The precipitation temperature of Ag 3 Sn plates was in the range of 160-202 o C and the undercooling was in the range of 15-57 o C. The undercooling of small solder balls was in the range of 29-63 o C, which was slightly larger than that of Ag 3 Sn plates. Once nucleated, Ag 3 Sn plates rapidly precipitated at the interface within 2 s, and the precipitation rate was estimated to be at least 5 m/s. The dissolution rate of Ag 3 Sn plate was significantly slower than the precipitation rate. It took about 40 s for Ag 3 Sn plates to dissolve into the molten solder, and the dissolution rate was estimated to be 1 m/s. Synchrotron radiation real-time in situ imaging technology provides a direct way to observe the microstructural evolution and measure the undercooling of Ag 3 Sn plates and solder bumps.

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“…Cu 6 Sn 5 and Cu 3 Sn) with various techniques. For instance, numerical analysis provides an approach to estimate the elastic moduli of Cu 6 Sn 5 , Cu 3 Sn and Ag 3 Sn [16][17][18]. Moreover, bulk intermetallics were prepared through casting and annealing processes to enable mechanical tests at a macro-scale [19,20], but residual porosity and oxides may emerge from these processes, degrading applicability of the results.…”

Section: Sn Imcs Formed In Snmentioning

confidence: 99%

Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending

et al. 2016

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Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

Cited by 30 publications

References 47 publications

The Mechanical Properties and Elastic Anisotropies of Cubic Ni3Al from First Principles Calculations

The Mechanical Properties and Elastic Anisotropies of Cubic Ni3Al from First Principles Calculations

Dissolution and precipitation of Ag<inf>3</inf>Sn plates in ultra fine solder joints using synchrotron radiation real-time imaging technology

Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending

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