Mechanical and electrical responses of nanostructured Cu–3wt%Ag alloy fabricated by ECAP and cold rolling

Ko, Young Gun; Namgung, Seung; Lee, Byung Uk; Shin, Dong Hyuk

doi:10.1016/j.jallcom.2010.02.198

Cited by 51 publications

(15 citation statements)

References 24 publications

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“…In the present study, that difference is slightly higher-about 7% IACS, although the copper used was of a lower purity. With lower purity or a higher content of alloying elements, the differences between the CG and the UFG copper will be more pronounced, as in the case of Cu-3 wt% Ag, where after eight passes of ECAP the electrical conductivity decreased from 97% IACS to 87% IACS [2].…”

Section: Electrical Conductivitymentioning

confidence: 99%

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

2017

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Samples of electrolytic tough pitch copper were deformed in equal channel angular pressing with enhanced productivity to quickly refine its initial coarsegrained microstructure at room temperature. The evolution in microstructure and changes in a broad range of properties were compared to a sample in the undeformed state. The microstructure evolution was evaluated using electron backscatter diffraction for both states and transmission electron microscopy for a detailed microstructure characterization of the deformed sample. The microstructure observations were correlated with the results of tensile tests, electrochemical tests in 3.5 wt% NaCl, electrical conductivity measurements and thermal stability up to 200°C. The ECAP process employed in this study caused a grain refinement from about 16 µm to about 600 nm. The microstructure refinement caused a 50% increase in both the YS and UTS. The elongation to failure, due to the high amount of LAGBs, maintained a high value of 13.3%. The corrosion and pitting potentials were higher for the deformed sample. Furthermore, the grain refinement caused a decrease in electrical conductivity from 100.2% IACS to 93.1% IACS, a drop of 7% IACS. The deformed sample displayed thermal stability up to a temperature of 175°C, where there was a drop in micro-hardness of more than 10%.

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Section: Electrical Conductivitymentioning

confidence: 99%

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

2017

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“…Engineering stress-strain curves for RT and LNT rolled as well as the annealed Cu3 at% Ag alloys. Stress-strain data taken from the literature for DPD Cu, 46) DPD and annealed Cu, 46) HPT-processed Cu, 47) ECAPprocessed Cu1.8 at% Ag alloy 48) are also included for comparison.…”

Section: Alloy Phases Far From Equilibriummentioning

confidence: 99%

Grain Boundaries and Diffusion Phenomena in Severely Deformed Materials

Wilde

Divinski

2019

Mater. Trans.

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The present knowledge on grain boundary-related phenomena specific for severely plastically deformed materials is reviewed and critically analyzed in detail. Severe plastic deformation is shown to introduce specific metastable states of the grain boundaries which are characterized by enhanced diffusion rates, high-density of specific structure elements and large (still localized) elastic strains. An intrinsic heterogeneity of the deformation-induced modifications is revealed and examined on different scales. Relations between the existence of deformation-modified grain boundaries, specific microstructure features and resulting properties are highlighted.

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“…[44] A somewhat different situation is observed in the case of hybrid processes, in which an ECAP-based process is combined with rolling or upsetting. [26,28,30,31,45] Figure 6 shows the microstructure of an AA 1350 sample after four passes of mtECAP process route C and also with subsequent upsetting. The division into planes reveals the differences the second process brings into the microstructure.…”

Section: Microstructural Features Of Ufg Platesmentioning

confidence: 99%

Ultrafine‐Grained Plates and Sheets: Processing, Anisotropy and Formability

2019

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Herein, the processing, anisotropy and formability of ultrafine‐grained (UFG) plates or sheets processed by various severe plastic deformation (SPD) methods are discussed. The methods capable of processing material in the form of sheets or plates are presented; these include accumulative roll bonding, different kinds of equal channel angular pressing and hybrid methods that combine SPD and conventional techniques. Their impact on microstructural features and mechanical properties, crystallographic textures and formability is discussed. Additionally, some examples of post‐SPD‐shaped materials are presented.

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Mechanical and electrical responses of nanostructured Cu–3wt%Ag alloy fabricated by ECAP and cold rolling

Cited by 51 publications

References 24 publications

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

Grain Boundaries and Diffusion Phenomena in Severely Deformed Materials

Ultrafine‐Grained Plates and Sheets: Processing, Anisotropy and Formability

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