“…In recent years, related studies using backward extrusion (Murakoshi et al, 2007), forward extrusion followed by normal rolling (Suzuki et al, 2003) or differential speed rolling (Suzuki et al, 2007), as well as special processing methods that can introduce large strain such as equal-channel angular pressing (ECAP) , high pressure torsion (HPT) (Takahashi et al, 2009), cyclic extrusion compression (CEC) (Peng et al, 2009) and friction extrusion (Tang and Reynolds, 2010) have been reported. Although the studies mentioned above have targeted single-phase materials, the solid-state recycling of machined chips into composite materials has also been attempted.…”