Measuring Thermal Conductivity Enhancement of Polymer Composites: Application to Embedded Electronics Thermal Design

Egan, E.; Amón, Cristina H.

doi:10.1615/jenhheattransf.v8.i2.50

Cited by 6 publications

(5 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…While many reports have focused on the assessment of thermal conductivity of the composite systems [5][6][7][14][15][16], few examples in the literature focus on the rheological properties [39]. With such sparse treatment of the rheological properties of this important engineering system, we tune our emphasis to a more complete characterization of the viscoelastic behavior of the BN/PDMS system.…”

Section: Concentration Dependency Of Complex Viscosity and Dynamic Momentioning

confidence: 99%

“…It is well understood that interfacial properties affect the wetting, dispersion, rheology and adhesion of the particles embedded in a polymer matrix [1][2][3][4]. The development of new particle/polymer composites is currently focusing on the performance characteristics of thermal management materials for electronic components [5][6][7][8][9]. The principle function of these materials is to dissipate heat from electronic devices while providing an electrically insulating barrier.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of hexafluoropropylene oxide plasma polymer particle coatings on the rheological properties of boron nitride/poly(dimethylsiloxane) composites

Bian

Lujan

Harper‐Nixon

et al. 2005

Journal of Colloid and Interface Science

View full text Add to dashboard Cite

Section: Concentration Dependency Of Complex Viscosity and Dynamic Momentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of hexafluoropropylene oxide plasma polymer particle coatings on the rheological properties of boron nitride/poly(dimethylsiloxane) composites

Bian

Lujan

Harper‐Nixon

et al. 2005

Journal of Colloid and Interface Science

View full text Add to dashboard Cite

“…The TCU is embedded in epoxy polymer [7] that simulates an electronic device embedded in a wearable computer [8], and a heat source unit is attached to the thermal control unit. To control the temperature for a specific electronic component, completely enclosing the heat source component by the thermal control unit is recommended for best performance.…”

Section: A Thermal Management With Phase Change Materialsmentioning

confidence: 99%

“…An increase in the heat transfer during PCMs phase change with low thermal conductivity is demonstrated by inserting a highly conductive metal matrix into the PCM. The matrix is dispersed in the PCM so that the mixture behaves thermally like a homogenous material with both high thermal conductivity and high heat capacity [7]. Practically, an application imposes a size limitation in the TCU, and the TCE reduces the volume available for the PCM.…”

Section: B Thermal Control Unit Componentmentioning

confidence: 99%

PCM thermal control unit for portable electronic devices: experimental and numerical studies

Alawadhi

Amón

2003

IEEE Trans. Comp. Packag. Technol.

162

View full text Add to dashboard Cite

This paper investigates the effectiveness of a thermal control unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices when their operating time is limited to a few hours. It is composed of an organic phase change material (PCM) and a thermal conductivity enhancer (TCE). To overcome the relatively low thermal conductivity of the PCM, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for modeling the TCU, which employ effective thermo-physical properties. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is then used to study the effect of important parameters that are experimentally expensive to examine, such as the PCM latent heat, Stefan number, and heat source power. It is shown that the TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement.

show abstract

“…Development of Thermal ModelFrom the application point of view, it is desirable to use thermal Finite Element Analysis (FEA) to predict heat dissipation from embedded actuators, and hence be able to assess their proper functionality in miniature devices on the design level. Since thermal modeling of embedded electronic components is a research area on its own[11][12][13][14], the experimental data was used to verify and calibrate the modeling approach. Also, because of the complexity of modeling a real actuator, a resistor was first used as a surrogate with similar heat generation and geometric characteristics.…”

mentioning

confidence: 99%

A Systematic Approach for Designing Multifunctional Thermally Conducting Polymer Structures With Embedded Actuators

Bejgerowski

Gupta

Bruck

2009

Journal of Mechanical Design

View full text Add to dashboard Cite

Thermally conductive filled polymers enable the creation of multifunctional structures that offer both anchoring points for the embedded actuators, as well as heat-dissipation functions, in order to facilitate the miniaturization of devices. However, there are two important challenges in creating these structures: (1) sufficient thermal management to prevent failure of the actuator and (2) the ability of the actuator to survive the manufacturing process. This paper describes a systematic approach for design of multifunctional structures with embedded heat-generating components using an in-mold assembly process to address these challenges. For the first challenge, the development of appropriate thermal models is presented along with incorporation of in-mold assembly process constraints in the optimization process. For the second challenge, a simulation of the molding process is presented and demonstrated to enable the determination of processing conditions ensuring survival of the in-mold assembly process for the embedded actuator. Thus, the design methodology described in this paper was utilized to concurrently optimize the choice of material, size of the structure, and processing conditions in order to demonstrate the feasibility of creating multifunctional structures from thermally conductive polymers by embedding actuators through an in-mold assembly process.

show abstract

Measuring Thermal Conductivity Enhancement of Polymer Composites: Application to Embedded Electronics Thermal Design

Cited by 6 publications

References 0 publications

Effect of hexafluoropropylene oxide plasma polymer particle coatings on the rheological properties of boron nitride/poly(dimethylsiloxane) composites

Effect of hexafluoropropylene oxide plasma polymer particle coatings on the rheological properties of boron nitride/poly(dimethylsiloxane) composites

PCM thermal control unit for portable electronic devices: experimental and numerical studies

A Systematic Approach for Designing Multifunctional Thermally Conducting Polymer Structures With Embedded Actuators

Contact Info

Product

Resources

About