Measuring the energy flux at the substrate position during magnetron sputter deposition processes

Cormier, Pierre‐Antoine; Balhamri, A.; Thomann, Anne-Lise; Dussart, Rémi; Semmar, Nadjib; Mathias, Jacky; Snyders, Rony; Konstantinidis, Stéphanos

doi:10.1063/1.4773103

Cited by 41 publications

(16 citation statements)

References 38 publications

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“…Magnetron Sputtering (HiPIMS) discharges were ignited successively. More details about the experimental setup and the HiPIMS pulse can be found in [9] and [10]. To study the influence of each discharge type, pressure and averaged power were set to 0.66 Pa (Argon) and 400 W,…”

Section: Magnetron (Dcms) Pulsed DC Magnetron (Pdcms) and High Pomentioning

confidence: 99%

IR emission from the target during plasma magnetron sputter deposition

et al. 2013

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In this article, energy flux measurements at the substrate location are reported. In particular, the energy flux related to IR radiation emanating from the titanium (10 cm in diam.) target surface is quantified during magnetron sputter deposition processes. In order to modulate the plasma-target surface interaction and the radiative energy flux thereof, the working conditions were varied systematically. The experiments were performed in balanced and unbalanced magnetic field configurations with direct current (DC), pulsed DC and high power impulse magnetron sputtering (HiPIMS) discharges. The power delivered to the plasma was varied too, typically from 100 to 800 W. Our data show that the IR contribution to the total energy flux at the substrate increases with the supplied sputter power and as the discharge is driven in a pulse regime. In the case of HiPIMS discharge generated with a balanced magnetic field, the energy flux associated to the IR radiation produced by the target becomes comparable to the energy flux originating from collisional processes (interaction of plasma particles such as ions, electron, sputtered atoms etc. with the substrate). From IR contribution, it was possible to estimate the rise of the target surface temperature during the sputtering process. Typical values found for a titanium target are in the range 210 °C to 870 °C

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Section: Magnetron (Dcms) Pulsed DC Magnetron (Pdcms) and High Pomentioning

confidence: 99%

IR emission from the target during plasma magnetron sputter deposition

et al. 2013

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“…A well characterized probe using a commercially available heat flux probe [14,28,65,66] based on thermopile (a stack of thermo couples) sensors has been used by Thomann, Dussard and coworkers for measurements in different plasma environments.…”

Section: Thermopile Sensormentioning

confidence: 99%

“…The different probe types and designs have been used for characterization of various plasmas which are used in materials processing, such as different types of magnetron discharges (dc [23,1,[17][18][19][20][21][22], rf [20,22,24], HiPIMS [25][26][27][28]) and hollow cathode arcs [29][30][31] for thin film deposition purposes. Also rf [24,[32][33][34][35][36] or microwave [24] plasmas and ion beams [37] for surface modification have been investigated.…”

Section: Introductionmentioning

confidence: 99%

Calorimetric Probes for Energy Flux Measurements in Process Plasmas

2014

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This chapter gives an overview of the method of calorimetric probes which are used for characterizing the interaction between low-temperature plasmas and substrates in materials processing. Although the focus is on low-temperature nonequilibrium plasmas most of the concepts can also be transferred to thermal plasmas or are in fact adopted from fusion research. An introductory section showing the importance and complexity of plasma wall interactions is followed by a section providing an overview and comparison of various probe concepts, which have been developed in the last decades. Special focus is on the type of probes which are similar to the probes used by J.A. Thornton (In fact, Thornton was not the first, to use this type of probe. From his work from 1978 [1], one can follow the citations back to the work of Jackson in 1969, who used equation (6.7) for the determination of the power dissipated by a copper block located at substrate position in a sputtering discharge [2]) who was one of the pioneers connecting plasma characteristics with resulting surface properties. Thereafter, a short section gives a basic overview of the different contributions to the total energy influx and which are of importance for the plasma wall interaction. The last section shows different examples of applications of calorimetric probes. It demonstrates the applicability and flexibility of these types of probes for characterization of different low-temperature plasmas. The examples

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“…One of the advantages related to HIP-IMS is the "cooler plasma" that reaches the substrate. By measuring the ion flux at the substrate position during HIPIMS and DC [23], it was shown that the energy per deposited atoms during a HIPIMS process is smaller than during DCMS or Pulsed DCMS. This is a direct result of the increased gas phase collision frequency of the sputtered and the sputtering species which, in the substrate vicinity (some 10 cm from the metal source), has also been shown to result in ion and electron temperatures close to room temperature in the substrate vicinity.…”

Section: Deposition On Temperature Sensitive Substratesmentioning

confidence: 99%