2016
DOI: 10.4071/isom-2016-thp34
|View full text |Cite
|
Sign up to set email alerts
|

Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces

Abstract: When dealing with production of Flip Chip Packages in semiconductor packaging, the angle between the die and package substrate is critical for maintaining product yield and reliability. Current outgoing quality checks for die tilt can be time consuming to measure heights via point to point measurement techniques. Existing die tilt measurement approaches can also have reproducibility issues from user to user. Shadow moiré technology is a full field optical inspection technique commonly used for f… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2016
2016
2016
2016

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
references
References 4 publications
0
0
0
Order By: Relevance