2013
DOI: 10.1088/0960-1317/23/9/095001
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Measurements of residual stresses in the Parylene C film/silicon substrate using a microcantilever beam

Abstract: A series of Parylene C film/silicon substrate bilayer microcantilever beams were fabricated by microelectromechanical processes for the study of residual stresses. The Parylene C films of 2 μm thickness were deposited on the Si substrates with various thicknesses. After deposition at room temperature, deflection of the beam was observed with deposited Parylene C on the concave side. While Parylene C has a higher coefficient of thermal expansion than Si, this deflection is believed to result from the thermal mi… Show more

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Cited by 8 publications
(3 citation statements)
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References 46 publications
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“…The shift of the Raman frequency of G (ω G ) and 2D (ω 2D ) modes determines the magnitude of in‐plain strain at the recording point. [ 38,39 ] To evaluate the spatial distribution of strain, we recorded multipoint spectra at 1 µm intervals from 30 × 30 µm area and then made 2D plots of the ω G –ω 2D (Figure 2c,d). As described in previous studies, when a bi‐axial strain is loaded into a graphene sheet, the plots of ω G ‐ω 2D shift on a single line with a slope (Δω 2D /Δω G ) of 2.2.…”
Section: Resultsmentioning
confidence: 99%
“…The shift of the Raman frequency of G (ω G ) and 2D (ω 2D ) modes determines the magnitude of in‐plain strain at the recording point. [ 38,39 ] To evaluate the spatial distribution of strain, we recorded multipoint spectra at 1 µm intervals from 30 × 30 µm area and then made 2D plots of the ω G –ω 2D (Figure 2c,d). As described in previous studies, when a bi‐axial strain is loaded into a graphene sheet, the plots of ω G ‐ω 2D shift on a single line with a slope (Δω 2D /Δω G ) of 2.2.…”
Section: Resultsmentioning
confidence: 99%
“…Various flexible electrode substrates have been used in the development of electrodes, including the use of parylene C as a substrate with the addition of Ag/AgCl as a conductive material, PDMS with graphene induction using laser methods, fabric treated with TPU added with MWCNTs and Ag composites, and cotton fabric as a substrate with the addition of PANI and silver nanoparticles (AgNPs). , These flexible electrodes could perform well to replace rigid, conventionally used Ag/AgCl electrodes based on the SNR value evaluation, as seen in Table for previous studies on flexible electrodes.…”
Section: Introductionmentioning
confidence: 99%
“…Many MEMS devices, including cantilevers, diaphragms, and freestanding structures are fabricated by silicon-based bulk and surface micromachining techniques. [11][12][13][14][15] Thin-film based MEMS devices are more easily affected by the residual stress in thin films than those fabricated on inorganic materials such as Si or glass. In general, high residual stress in thin films is considered to be the cause of micro-crack formation and peeling of films from substrates.…”
Section: Introductionmentioning
confidence: 99%