1998
DOI: 10.1080/00150199808014881
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Measurement of thermal properties of thin dielectric films and anisotropic solids by ac hot-strip method

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Cited by 6 publications
(5 citation statements)
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“…It was revealed that for the condition h f << d p << h s (here h f is the thickness of the film, d p thermal waves penetration depth (d p = (λ s /2c s ω) 1/2 , λ s , c s heat conductivity coefficient and specific heat of a substrate), h s the thickness of the substrate), important asympthotic relation can be obtained for the ratio of the complex temperature oscillations of the probes deposited on the film and on the substrate (Figure 1). This ratio has a form [26]…”
Section: Methodsmentioning
confidence: 99%
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“…It was revealed that for the condition h f << d p << h s (here h f is the thickness of the film, d p thermal waves penetration depth (d p = (λ s /2c s ω) 1/2 , λ s , c s heat conductivity coefficient and specific heat of a substrate), h s the thickness of the substrate), important asympthotic relation can be obtained for the ratio of the complex temperature oscillations of the probes deposited on the film and on the substrate (Figure 1). This ratio has a form [26]…”
Section: Methodsmentioning
confidence: 99%
“…Our experimental setup was described in [26] in full detail. The experimental errors of measurements of c f and λ f at the temperature range of 300-400 K was estimated as 3-5% and 2-3% for lower temperatures; the film thickness variation was 20-1100 nm.…”
Section: Methodsmentioning
confidence: 99%
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