Measurement of thermal-mechanical noise in microelectromechanical systems

Stievater, Todd H.; Rabinovich, William S.; Newman, H. S.; Mahon, Rita; Goetz, Peter G.; Ebel, J.; McGee, David J.

doi:10.1063/1.1505122

Cited by 23 publications

(12 citation statements)

References 12 publications

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“…This implies that the noise measured here has its origin in the thermal motion of air molecules (Brownian motion) surrounding the bridge. These calculations are discussed in detail elsewhere [21]. Thermal-mechanical noise has been studied extensively with respect to cantilevers for scanning probe microscopy tips, [16] and recently a microcavity technique similar to that used in this work discussed thermal noise in tunable Fabry-Perot filters [22].…”

Section: High Resolution Measurementsmentioning

confidence: 99%

Microcavity interferometry for MEMS device characterization

Stievater

Rabinovich

Newman

et al. 2003

J. Microelectromech. Syst.

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We have developed a high resolution optical technique to measure the electromechanical properties of MEMS microstructures. The technique is applied to microbridges developed for capacitive switching in coplanar radio frequency (RF) waveguides. The thin metal ground plane on the substrate and the bottom of the bridge together form a microcavity for an optical beam. The wavelength of a cavity mode is a sensitive measure of the bridge position relative to the substrate. The technique is applied to the measurement of resonances and damping times of microbridges of varying lengths. It is also used to measure dc changes in bridge height of tenths of nanometers, driven ac displacements of less than a picometer, and bridge displacement noise of hundreds of femtometers per root Hertz. This extreme sensitivity exceeds previously demonstrated optical characterization methods.[870]Index Terms-Capacitive switch, optical interference, optical microcavity, RF MEMS.

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Section: High Resolution Measurementsmentioning

confidence: 99%

Microcavity interferometry for MEMS device characterization

Stievater

Rabinovich

Newman

et al. 2003

J. Microelectromech. Syst.

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“…This result can be further simplified in the case of onedimensional motion of a device with uniform cross-sectional area A, in which case the effective mass will be defined as [44] m eff,n = ρA…”

Section: Effective Massmentioning

confidence: 99%

“…In general, the complete, threedimensional motion will be given by a displacement function R(x,t) that can be broken down into an infinite number of independent modes. To each mode we ascribe a label, n, allowing for the displacement function to be expressed as [44,54] R(x,t) = ∑ n a n (t)r n (x),…”

Section: Motion Of a Resonatormentioning

confidence: 99%

“…Thermomechanical calibration has been used to measure * Electronic address: bhauer@ualberta.ca † Electronic address: jdavis@ualberta.ca the motion of many systems, including cantilevers [29,30,33,[38][39][40][41][42][43], doubly clamped beams [10,[44][45][46], strings [28,32], torsional resonators [5,13,[47][48][49], and membranes [50,51]. However, to the best of our knowledge, no single standalone document exists that describes the method of thermomechanical calibration in its entirety.…”

Section: Introductionmentioning

confidence: 99%

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A general procedure for thermomechanical calibration of nano/micro-mechanical resonators

et al. 2013

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We provide a detailed description of a general procedure by which a nano/micro-mechanical resonator can be calibrated using its thermal motion. A brief introduction to the equations of motion for such a resonator is presented, followed by a detailed derivation of the corresponding power spectral density (PSD) function. The effective masses for a number of different resonator geometries are determined using both finite element method (FEM) modeling and analytical calculations.

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“…The mechanical noise is due to the Brownian motion of the proof mass [12,13]. For the electrical noise, the thermal noise including kT/C noise and flicker noise are considered.…”

Section: Noise Considerationsmentioning

confidence: 99%

Low noise accelerometer microsystem with highly configurable capacitive interface

Cho

2010

Analog Integr Circ Sig Process

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This paper presents a low noise accelerometer microsystem with a highly configurable capacitive interface circuit. A programmable capacitive readout circuit is designed to minimize the offset and gain error due to the parasitic capacitance mismatch and the process variations. The interface circuit is implemented in a 0.5 lm 2P3M CMOS technology with EEPROM. The interface circuit and MEMS sensing element are integrated in a single package, and consist the accelerometer microsystem. The supply voltage and supply current of the system are 5 V and 1.17 mA, respectively. The input range and gain are 2.5 V and 0.5 V/g, respectively. The max-min gain error and max-min offset error after calibration was measured to be 1.2% FSO and 3.3% FSO, respectively. The signal to noise ratio (SNR) and noise equivalent resolution (NER) are measured to be 93.1 dB and 110.6 lg/HHz, respectively, when a 40 Hz, 5 g sinusoidal input acceleration is applied.

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Measurement of thermal-mechanical noise in microelectromechanical systems

Cited by 23 publications

References 12 publications

Microcavity interferometry for MEMS device characterization

Microcavity interferometry for MEMS device characterization

A general procedure for thermomechanical calibration of nano/micro-mechanical resonators

Low noise accelerometer microsystem with highly configurable capacitive interface

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