Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moire Interferometry

Han, Bongtae; Wu, Zhongqing; Cho, S.

doi:10.1111/j.1747-1567.2001.tb00020.x

Cited by 13 publications

(5 citation statements)

References 7 publications

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“…Thus, the deformation incurred by the temperature increment is locked into the grating and recorded at room temperature. Numerous examples can be found in the literature [20,21,[23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39][40][41].…”

Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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Moiré interferometry has been a valuable experimental technique for the understanding of the mechanical behavior of materials and structures. Over the last decade less emphasis has been placed on the development of the technique and more towards applications. This paper is a review article on recent applications using moiré interferometry in the fields of microelectronics devices, material characterization, micromechanics, residual stress, composite materials, fracture mechanics, and biomechanics. The general principles of moiré interferometry and advancement of techniques will not be discussed in this text, but references will be provided.

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Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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“…Recently, the development of moiré interferometry technology utilizing lasers has demonstrated exceptional precision [7][8][9]. Moiré interferometry offers several advantages, including non-contact measurement and high precision assessment of deformation over a whole area.…”

Section: Introductionmentioning

confidence: 99%

Thermo‐mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometry

Joo

2024

Materialwissenschaft Werkst

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Plastic ball‐grid array (PBGA) package assembly comprises various materials with different thermo‐mechanical properties, and the solder ball‐grid patterns can significantly influence the package deformation and solder ball stress. This study utilizes moiré interferometry to investigate the deformation behavior of wire bonded plastic ball‐grid array (WB‐PBGA) packages under varying temperatures. Real‐time moiré interferometry experiments were conducted to capture fringe patterns representing package deformation at different temperature stages. Experiments were conducted for three different wire bonded plastic ball‐grid array packages with distinct solder ball array configurations: full grid patterns (WB‐PBGA‐FG) and perimeter patterns with/without central connections (WB‐PBGA‐PC/P). The analysis revealed considerable variations in thermal strain distribution and positioning of the critical solder ball within the package assembly, depending on the solder ball‐grid pattern. Among these wire bonded plastic ball‐grid array packages, WB‐PBGA‐P/C exhibited the most substantial bending deformation, experiencing the highest effective strain, which directly impacts solder ball failure. These findings emphasize the importance of solder ball‐grid patterns in understanding the deformation behavior and reliability of WB‐PBGA packages under varying temperature conditions.

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“…The Moiré interferometry method has the advantages of very high precision and the ability to measure the deformation of the whole field in a noncontact manner and is not significantly affected by the surrounding environment, such as vibration and light. Owing to these advantages, the Moiré interferometry method has recently been effectively used in thermal deformation analysis of small electronic components [5][6][7][8][9][10][11][12][13][14]. The application of this method has also been extended to mechanical bending analysis and thermal strain analysis of electronic packages [15,16].…”

Section: Introductionmentioning

confidence: 99%

Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry

Kim

Joo

2023

Materialwissenschaft Werkst

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When the temperature of the package assembly is changed, non‐uniform deformation and local stress may occur owing to the different thermal expansion coefficients of the constituent materials, while concentrated thermal stress may cause significant failure. In this study, we carry out an experiment and analysis of the thermal deformation of a flip chip plastic ball grid array package with respect to temperature change. Interference fringe patterns representing the displacement distribution of each temperature stage are obtained using a Moiré interferometry and the bending deformation behavior and the strain of the solder ball are analyzed thereafter. We compare the deformation behavior of a single‐sided package assembly and a double‐sided package assembly. The effective strain, which significantly affects the failure of the solder ball, is found to be the largest in the solder ball just outside the edge of the chip in the case of the single‐sided package assembly. In the case of the double‐sided package assembly, the maximum effective strain is found in the solder ball just inside the edge of the chip, with a value approximately 50 % larger than in the case of the single‐sided package assembly.

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Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moire Interferometry

Cited by 13 publications

References 7 publications

Recent Applications of Moiré Interferometry

Recent Applications of Moiré Interferometry

Thermo‐mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometry

Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry

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