Measurement of the noise parameters of semiconductor devices

This paper presents methods of obtaining film structures based on polyvinyl alcohol, polymethylmethacrylate with multi-walled carbon nanotubes on various substrates by pulling out of solution and drying with subsequent application of metal contacts. Test samples of polymer film structures with carbon nanotubes with curing in strong electric and magnetic fields for the orientation of with multi-walled carbon nanotubes in the polymer were prepared. The topography of the film surface was studied by atomic force microscopy. By treating nanotubes in a solution of iron chloride (III) and NaOH in diethylene glycol, their magnetic susceptibility is significantly increased, which makes it possible to equalize such "magnetic" carbon nanotubes in the polymer in magnetic fields with an induction of less than 0,5 T. The volt-ampere, C-V and noise characteristics of film structures at temperatures from – 60 ° C to 100 ° C and pressures up to 2 MPa were studied.

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“…Capacitance and noise spectroscopy methods were used to study the dielectric and noise characteristics of test film structures. [19,20].…”

Section: Characterizationmentioning

confidence: 99%

Preparation and properties of electrically conductive film nanocomposites

Makarova

Buzaeva²,

Segeev³

2023

E3S Web of Conf.

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“…In this regard, the methods of indirect determination of the crystal temperature of the device, based on the control of temperature-dependent parameters (TDP) inherent in the device under test, are actively used. The direct current voltage drop on the TJ p-n junction, the transconductance of the transistor S, reverse current (IRR) and the characteristics of the reverse pn junction recovery process (tRR, IRR,max), signal delay-propagation time tD [12][13][14] are usually used as IC TDP. When choosing a TDP HFPVC circuits, the following conclusions can be made.…”

Section: Literature Reviewmentioning

confidence: 99%

Determination of transient thermal characteristics for thermal electric behavioral models of integrated circuits

Potapov

Shkolin

2020

Bulletin EEI

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In the current study, it was tried to describe a method for determining thermal characteristics of integrated micro-circuits to identify thermal parameters of multidisciplinary (thermal-electric) behavioral models. The problem is solved on the example of high-frequency pulse voltage converters. A solution was proposed to refine the minimum structure of the thermoelectric model based on an iterative least squares method using the Levenberg-Marquardt algorithm, as well as a graph of the spectral den-sity of time constants. This made it possible to reduce the influence of the filtering factor in the deconvolution operation when building a thermal model using the structural function of the thermal characteristic transition. Also, the results obtained can be used to build integrated circuits (IC) behavioral models, taking into account the thermal processes occurring in them.

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The systematic errors of the measurement of the parameters of low-frequency noise with a 1/f γ spectrum

Сергеев

Dulov

2008

Meas Tech

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Measurement of the noise parameters of semiconductor devices

Cited by 5 publications

References 1 publication

Preparation and properties of electrically conductive film nanocomposites

Preparation and properties of electrically conductive film nanocomposites

Determination of transient thermal characteristics for thermal electric behavioral models of integrated circuits

The systematic errors of the measurement of the parameters of low-frequency noise with a 1/f γ spectrum

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