Measurement of particle velocity and characterization of deposition in aluminum alloy kinetic spraying process

Wu, Jingwei; Fang, Hongyuan; Yoon, Suk Bon; Kim, Hyungjun; Lee, Changhee

doi:10.1016/j.apsusc.2005.02.108

Cited by 97 publications

(24 citation statements)

References 7 publications

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“…Cold spraying has developed in this decade as a new technology for attaining high-quality coatings because of its lower heating of the powder materials (Ref [1][2][3][4][5]. Mechanically softer materials have been effectively coated by the process, and coating properties that are superior compared with conventional coatings thermally sprayed have been indicated ( Ref 6).…”

Section: Introductionmentioning

confidence: 99%

Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process

et al. 2007

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The deposition behavior of sprayed individual metallic particles on the substrate surface in the cold spray process was fundamentally investigated. As a preliminary experiment, pure copper (Cu) particles were sprayed on mirror-polished stainless steel and aluminum (Al) alloy substrate surfaces. Process parameters that changed systematically were particle diameter, working gas, gas pressure, gas temperature, and substrate temperature, and the effect of these parameters on the flattening or adhesive behavior of an individual particle was precisely investigated. Deposition ratio on the substrate surface was also evaluated using these parameters. From the results obtained, it was quite noticeable that the higher substrate temperature brought about a higher deposition rate of Cu particles, even under the condition where particles were kept at room temperature. This tendency was promoted more effectively using helium instead of air or nitrogen as a working gas. Both higher velocity and temperature of the particles sprayed are the necessary conditions for the higher deposition ratio in the cold spraying. However, instead of particle heating, substrate heating may bring about the equivalent effect for particle deposition.

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Section: Introductionmentioning

confidence: 99%

Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process

et al. 2007

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“…[1][2][3][4][5] Coatings of relatively soft metals have been effectively produced by the process and superior coating properties compared with conventional thermally-sprayed coatings have been reported. [6][7][8][9][10][11] To get a high quality coating, utilization of fine particles may be effective as a more dense coating is likely to be fabricated by the fine particles.…”

Section: Introductionmentioning

confidence: 99%

Deposition of Copper Fine Particle by Cold Spray Process

et al. 2009

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To improve the deposition efficiency of copper fine particles mean diameter around 5 mm onto metallic substrate surface in cold spray process, optimization in nozzle design was performed by numerical simulation. Particles velocity reached up to 585 m/s under the optimum conditions with originally designed nozzle based on the simulation results. In the spraying of copper particles onto normal steel substrate, lamellar-like microstructure was formed near the interface in the steel substrate. Correspondingly, remarkable hardness increase in this lamellarlike region of the steel substrate was recognized due to the higher velocity of the particles attained. Moreover, to reduce the bow shock effect especially for fine particles on the substrate surface in cold spray process, special nozzle was newly designed. The deposition efficiency, Vickers hardness and coating adhesion strength increased significantly especially in case of fine particles, as well as at higher pressure level of the working gas, while nominal particle velocity decreased with the special nozzle. Numerical simulation indicated that the pressure levels on the substrate surface decreased effectively in the newly designed special nozzle. In the observation of sprayed individual particles onto the substrate, extended metal jet was recognized at the splat's periphery when the particle was sprayed with the special nozzle. The results indicate that the decrease of particles velocity due to bow shock was suppressed effectively in the special nozzle as compared to the conventional one.

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“…Wu et al [17] present the measurement of particle velocity and characterization of deposition in aluminum alloy by kinetic spraying process. The results showed that particle velocity increases with increasing the process gas pressure and temperature.…”

Section: Impact Velocity Analysismentioning

confidence: 99%

Surface roughness optimization of cold-sprayed coatings using Taguchi method

Goyal

Walia

Sidhu³

2011

Int J Adv Manuf Technol

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In this paper, Taguchi L 18 orthogonal array have been employed for depositing the electro-conductive coatings by varying various process parameters, i.e., substrate material, type of powder feeding arrangement, stagnation gas temperature, stagnation gas pressure, and stand-off distance. The response parameter of the coatings so produced is measured in terms of surface roughness. The optimum process parameters are predicted on the basis of analyses (ANOVA) of the raw data and signal to noise ratio. The significant process parameters in order of their decreasing percentage contribution are: stagnation pressure, stand-off distance, substrate material, stagnation temperature of the carrier gas, and feed arrangement of the powder particles, respectively.

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Measurement of particle velocity and characterization of deposition in aluminum alloy kinetic spraying process

Cited by 97 publications

References 7 publications

Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process

Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process

Deposition of Copper Fine Particle by Cold Spray Process

Surface roughness optimization of cold-sprayed coatings using Taguchi method

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