Abstract:Thermally induced strain caused by device packaging is studied in high-power semiconductor laser arrays by a novel non-invasive technique. Measurements with intentionally strained laser array devices for 808 run emission reveal spectral shifts of quantum-confined optical transitions in the optical active region. These shifts by up to 10 meV serve as a measure for strain and are compared with model calculations. We demonstrate that different packaging techniques cause different packaging-induced strains. We als… Show more
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