Measurement of liquid-solid contact in film boiling

Uchi, Yoshihiro Kik; Ebisu, Takeshi; Michiyoshi, Itaru

doi:10.1016/0017-9310(92)90047-v

Cited by 22 publications

(2 citation statements)

References 7 publications

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“…Liquid/solid contact in film boiling was noted in some prior film boiling studies [36][37][38][39]. Its primary influence is as a precursor to film destabilization.…”

Section: Apparatus and Uncertaintymentioning

confidence: 97%

High Temperature Thermal Decomposition of Diethyl Carbonate by Pool Film Boiling

Avedisian

Kuo

Tsang

et al. 2018

Journal of Heat Transfer

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We use the configuration of film boiling on a horizontal tube positioned in a stagnant pool of saturated diethyl carbonate (DEC, (C2H5O)2CO) to study DEC decomposition at temperatures up to 1500 K. The composition of bubbles that percolate through the liquid pool is measured and the results are used to infer the decomposition reactions. The results show that below tube temperatures of about 1100 K, the decomposition products are ethylene (C2H4), carbon dioxide (CO2), and ethanol (EtOH, C2H5OH) with a molar ratio nC2H4/nCO2∼1, which is consistent with a first-order decomposition process. At higher temperatures, nC2H4/nCO2 > 1 which is explained by an additional route to forming C2H4 from radicals in the system (created by EtOH decomposition) attacking DEC. The presence of H2, CO, CH4, and C2H6 in the product stream was noted at all temperatures examined with concentrations that increased from trace values at low temperatures to values comparable to the DEC unimolecular process at the highest temperatures. Formation of a carbon layer on the tube was observed but did not appear to influence the decomposition process. A scale analysis shows that the rate constant controls decomposition compared to the residence time, which has a weaker dependence on temperature.

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“…Liquid/solid contact in film boiling was noted in some prior film boiling studies [36][37][38][39]. Its primary influence is as a precursor to film destabilization.…”

Section: Apparatus and Uncertaintymentioning

confidence: 97%

High Temperature Thermal Decomposition of Diethyl Carbonate by Pool Film Boiling

Avedisian

Kuo

Tsang

et al. 2018

Journal of Heat Transfer

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“…Considering the liquid-solid contact time s c $ 10 À1 s, 27,28 the transient cooling of the microstructures is simplified to quasi-steady state, one-dimensional fin analysis due to a large axial fin Fourier number Fo L ¼ a s s c /L 2 , and small radial fin Biot number Bi D ¼ hD/hki for the MPC surface (Fo L > 1, and Bi D < 10 À3 ), 29 where a s , h and hki are the fin thermal diffusivity, heat transfer coefficient, and effective thermal conductivity of microstructures. The fin calculation is based on the Murray-Gardner assumptions.…”

mentioning

confidence: 99%

Minimum film-boiling quench temperature increase by CuO porous-microstructure coating

Kang

Lee

Kaviany

et al. 2017

Applied Physics Letters

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Increase in the minimum film-boiling quench temperature, T MFB , is achieved with microstructured CuO particles, and attributed to local cooling (fin effect) by the microstructure causing liquid-solid contact. A periodic structure is obtained using electrochemical deposition of 1 lm diameter particles on brass sphere diameter 15 mm forming unit-cell porous cones of average height L ¼ 100 lm and base diameter D ¼ 20 lm. Fin analysis predicts the cone tip cooling to the homogeneous nucleation temperature of water ($330 C), while the base temperature is at 600 C. This causes liquid-solid contact during quenching, and analysis suggests the fin effective thermal conductivity hki and fin characteristic length L 2 /D are key to this liquid-solid contact that influences T MFB .

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Solid-Liquid-Gas Systems

Kaviany

2001

Mechanical Engineering Series

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Measurement of liquid-solid contact in film boiling

Cited by 22 publications

References 7 publications

High Temperature Thermal Decomposition of Diethyl Carbonate by Pool Film Boiling

High Temperature Thermal Decomposition of Diethyl Carbonate by Pool Film Boiling

Minimum film-boiling quench temperature increase by CuO porous-microstructure coating

Solid-Liquid-Gas Systems

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