Abstract:The power density delivered by particles to an electrically isolated substrate in an asymmetric bipolar pulsed dc unbalanced magnetron has been quantified. The plasma source was operated in argon with a titanium target, and measurements were made using both a calorimeter probe and time-resolved Langmuir probe incorporated into a specially made substrate holder. The main results from the calorimeter probe show clearly that with increased pulse frequency (from dc to 350kHz) and reduced duty cycle (90%–50%), the … Show more
“…The thermal capacity of the probe was calculated using C P = m c P = 0.31 J/K, where m = 0.803 g is the mass of the probe and c P is the specific heat of copper, with an estimated accuracy of about ±10 %. The method used to determine the heat transfer to the substrate is based on the temporal evolution of a small calorimeter probe's temperature located at the position of the substrate [30,31].…”
Section: Power Flux Measurementsmentioning
confidence: 99%
“…The measured power flux density was P tot−15 = 38 mW/cm 2 and P tot−500 = 33 mW/cm 2 for pulse delays of 15 μs and 500 μs, respectively. The energy fluxes of particular species (ions, electrons and neutral particles) were calculated using the model described previously [7,31]. Input parameters (plasma density, electron temperature, plasma and floating potential) were taken from our Langmuir probe measurements.…”
Time-resolved measurements have been performed during dual High Power Impulse Magnetron Sputtering (dual-HiPIMS) with two cathodes in a closed magnetic field configuration. The effect of a delay between subsequent pulses on electron density, mean electron energy, and ion flux to the substrate was investigated by time-resolved diagnostic methods. Two different delays of 15 μs and 500 μs between subsequent pulses were investigated. The dual-HiPIMS system, operated at a repetition frequency f = 100 Hz and duty cycle of 1 %, was equipped with different metallic targets (Ti, Cu). It is shown that a delay between subsequent pulses influences the plasma parameters and can be used to control deposition processes. It was noted that target surfaces (alternately serving as a cathode/anode) are contaminated by sputtered material from the previous pulse which influences the time-evolution of the discharge parameters.
“…The thermal capacity of the probe was calculated using C P = m c P = 0.31 J/K, where m = 0.803 g is the mass of the probe and c P is the specific heat of copper, with an estimated accuracy of about ±10 %. The method used to determine the heat transfer to the substrate is based on the temporal evolution of a small calorimeter probe's temperature located at the position of the substrate [30,31].…”
Section: Power Flux Measurementsmentioning
confidence: 99%
“…The measured power flux density was P tot−15 = 38 mW/cm 2 and P tot−500 = 33 mW/cm 2 for pulse delays of 15 μs and 500 μs, respectively. The energy fluxes of particular species (ions, electrons and neutral particles) were calculated using the model described previously [7,31]. Input parameters (plasma density, electron temperature, plasma and floating potential) were taken from our Langmuir probe measurements.…”
Time-resolved measurements have been performed during dual High Power Impulse Magnetron Sputtering (dual-HiPIMS) with two cathodes in a closed magnetic field configuration. The effect of a delay between subsequent pulses on electron density, mean electron energy, and ion flux to the substrate was investigated by time-resolved diagnostic methods. Two different delays of 15 μs and 500 μs between subsequent pulses were investigated. The dual-HiPIMS system, operated at a repetition frequency f = 100 Hz and duty cycle of 1 %, was equipped with different metallic targets (Ti, Cu). It is shown that a delay between subsequent pulses influences the plasma parameters and can be used to control deposition processes. It was noted that target surfaces (alternately serving as a cathode/anode) are contaminated by sputtered material from the previous pulse which influences the time-evolution of the discharge parameters.
“…It was observed that the fluorine content in the doped thin films is in the range of 0-7.4 at.%, which is low in comparison to the amount of fluorine incorporated into the powder targets (0-13 at.%). This can be explained by the fact that fluorine is a light element (Z = 9) and may be more readily scattered during gas phase transport through the high density plasma [19]. …”
Section: Elemental Analysismentioning
confidence: 99%
“…Čada et al measured the power density at the substrate in order to assess the interaction between the plasma and the substrate and quantify the energy balance. They concluded that pulsing the magnetron discharge provides higher energy transfer to the growing film this, in turn, produces denser film structures [19].…”
Fluorine doped tin oxide (FTO) coatings have been prepared using the mid-frequency pulsed DC closed field unbalanced magnetron sputtering technique in an Ar/O2 atmosphere using blends of tin oxide and tin fluoride powder formed into targets. FTO coatings were deposited with a thickness of 400 nm on glass substrates. No post-deposition annealing treatments were carried out. The effects of the chemical composition on the structural (phase, grain size), optical (transmission, optical band-gap) and electrical (resistivity, charge carrier, mobility) properties of the thin films were investigated. Depositing FTO by magnetron sputtering is an environmentally friendly technique and the use of loosely packed blended powder targets gives an efficient means of screening candidate compositions, which also provides a low cost operation. The best film characteristics were achieved using a mass ratio of 12% SnF2 to 88% SnO2 in the target. The thin film produced was polycrystalline with a tetragonal crystal structure. The optimized conditions resulted in a thin film with average visible transmittance of 83% and optical band-gap of 3.80 eV, resistivity of 6.71 × 10
“…Due to the simplicity of calorimetric probes they can easily be integrated into a substrate holder as performed by Ball [45] or Cada et al [49] (see Figs. 6.4f and 6.5a).…”
This chapter gives an overview of the method of calorimetric probes which are used for characterizing the interaction between low-temperature plasmas and substrates in materials processing. Although the focus is on low-temperature nonequilibrium plasmas most of the concepts can also be transferred to thermal plasmas or are in fact adopted from fusion research. An introductory section showing the importance and complexity of plasma wall interactions is followed by a section providing an overview and comparison of various probe concepts, which have been developed in the last decades. Special focus is on the type of probes which are similar to the probes used by J.A. Thornton (In fact, Thornton was not the first, to use this type of probe. From his work from 1978 [1], one can follow the citations back to the work of Jackson in 1969, who used equation (6.7) for the determination of the power dissipated by a copper block located at substrate position in a sputtering discharge [2]) who was one of the pioneers connecting plasma characteristics with resulting surface properties. Thereafter, a short section gives a basic overview of the different contributions to the total energy influx and which are of importance for the plasma wall interaction. The last section shows different examples of applications of calorimetric probes. It demonstrates the applicability and flexibility of these types of probes for characterization of different low-temperature plasmas. The examples
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