Measurement of Electrical Resistivity of Nanostructured Platinum Thin Films and Quantum Mechanical Estimates

Salvadori, M. C.; Vaz, Alfredo R.; Farías, Rurik; Cattani, M.

doi:10.4028/www.scientific.net/jmnm.20-21.775

Cited by 4 publications

(7 citation statements)

References 23 publications

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“…12,16 The comparison between our predictions and the complete experimental data is persented in our papers. [10][11][12]17 A good agreement was found between experiment and theory.…”

Section: Surface-induced Resistivity Of Metallic and Semiconducting Tsupporting

confidence: 70%

“…Using the Fishman and Calecki model 1,2 to explain the experimental data for Pt and Au, [10][11][12]17 we verified that the predicted ξ values obtained with their approach are in the interval 0.14 ≤ ξ ≤ 0.6 nm. These values are smaller or nearly equal to the lattice constants (∼0.4 nm) of these metals.…”

Section: Appendix Bsupporting

confidence: 57%

“…In this series, h n and λ n are the amplitudes and wavelengths, respectively, of the surface undulations created by the granular structure of the surface. [10][11][12][14][15][16][17] As shown in Appendix A, the matrix element h kk , given by Eq. (11), diverges as L → ∞.…”

Section: Assuming a Surface Isotropy H(x Y) = H(ρ) H Kk Is Written Asmentioning

confidence: 99%

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Surface-Induced Electrical Resistivity of Conducting Thin Films

Cattani

Salvadori

Bassalo³

2005

Surf. Rev. Lett.

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A quantum approach is proposed to calculate the surface-induced electrical resistivity of metallic and semiconducting thin films when several subbands of Fermi participate of the electronic transport. The application of this approach to explain the experimental resistivity data of Pt and Au thin films is briefly reported. The surface-induced resistivity is calculated in detail for the particular case of semiconducting films with only one subband.

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“…12,16 The comparison between our predictions and the complete experimental data is persented in our papers. [10][11][12]17 A good agreement was found between experiment and theory.…”

Section: Surface-induced Resistivity Of Metallic and Semiconducting Tsupporting

confidence: 70%

Section: Appendix Bsupporting

confidence: 57%

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Surface-Induced Electrical Resistivity of Conducting Thin Films

Cattani

Salvadori

Bassalo³

2005

Surf. Rev. Lett.

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“…The difference can be explained by additional contact resistances as well as the fact that the resistivity of platinum thin films is known to be higher than the bulk value. A factor of five is reported for 20 nm platinum thick films [34,35].…”

Section: Folding and Electrical Characterization Of Conductive Hingesmentioning

confidence: 91%

Capillary origami of micro-machined micro-objects: Bi-layer conductive hinges

Legrain¹,

Berenschot²,

Tas³

et al. 2015

Microelectronic Engineering

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Recently, we demonstrated controllable 3D self-folding by means of capillary forces of silicon-nitride microobjects made of rigid plates connected to each other by flexible hinges (Legrain et al., 2014). In this paper, we introduce platinum electrodes running from the substrate to the plates over these bendable hinges. The fabrication yield is as high as (77 ± 2)% for hinges with a length less than 75 μm. The yield reduces to (18 ± 2)% when the length increases above 100 μm. Most of the failures in conductivity are due to degradation of the platinum/ chromium layer stack during the final plasma cleaning step. The bi-layer hinges survive the capillary folding process, even for extremely small bending radii of 5 μm, nor does the bending have any impact on the conductivity. Stress in the different layers deforms the hinges, which does not affect the conductivity. Once assembled, the conductive hinges can withstand a current density of (1.6 ± 0.4) × 10 6 A/cm 2 . This introduction of conductive electrodes to elastocapillary self-folded silicon-based micro-objects extends the range of their possible applications by allowing an electronic functionality of the folded parts.

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“…These values are higher than theoretical values of respectively (64 ± 18) Ω and (32 ± 5) Ω, calculated from the bulk value of resistivity of Platinum, ρ b = 1.06 × 10 −7 Ω m. The difference can be explained by additional contact resistances as well as the fact that the resistivity of Platinum thin films is known to be higher than the bulk value. A factor 5 is reported for 20 nm Platinum thick films [75,76]. It seems therefore likely that the resistivity is larger than the bulk value in our situation, especially for a Platinum thickness of 75 nm.…”

Section: Folding and Electrical Characterization Of Conductive Hingesmentioning

confidence: 51%

Elastocapillary self-folding of micro-machined structures

Legrain

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Standard lithographic techniques have proven to be inadequate at machining true 3D micro-structures-structures with similar dimensions in all directions or with large height to width ratio. New fabrication paradigms are necessary. Combining the assets of mask-based techniques with self-assembly, self-folding is a proven and still promising approach to bring micro-structures to the third dimension. Pre-tethered parts are assembled using an external stimuli such as magnetic forces, pre-stressed layers, thermal shrinking... The work presented in this thesis deals with the self-folding of micro-machined three-dimensional silicon nitride structures using the surface tension of water, method termed elastocapillary folding or capillary origami. A technique for the controllable capillary folding of 3D micro-structures by means of through-wafer liquid application was developed. For the first time hydro-mechanical, repeatable, actuation of capillary folded structures via the addition or retraction of water on demand has been demonstrated. Silicon nitride objects made of thick flaps interconnected by flexible hinges were machined with a central through-wafer tube and connected to a dedicated pumping system to enable assembly. When remaining wetted, structures can be assembled and reopened up to several dozens of times and still reach the same final folding angle. Objects were actuated up to 60 times without signs of wear. Extracted curves from the self-folding experiments are in agreement with a two-dimensional elastocapillary folding model. When structures are allowed to dry in between foldings, an increase in the bending stiffness of the hinges is observed, by a factor 50 % after first folding and subsequent drying. This stiffening causes a decrease of the finally achieved angle. Residue from the fabrication process found on the structures after folding is suspected to be the cause of the stiffening. Using the same type of structures, Platinum electrodes running from the substrate to the plates via the bendable hinges were introduced. The fabrication yield was as high as (77 ± 2) % for hinges with a length less than 75 µm. The yield reduced to (18 ± 2) % when the length increased above 100 µm. Most of the failures in conductivity were due to evaporation of metal during the plasma cleaning step at the end of the fabrication. The bi-layer hinges survived the capillary folding process, even for extremely small bending radii of 5 µm, nor does the bending have any impact on the conductivity. Once assembled, the conductive hinges can withstand a current density of (1.6 ± 0.4) × 10 6 A/cm 2. Stress in the different layers caused apparent deformation of the hinges. This introduction of conductive electrodes to elastocapillary self-folded silicon based micro-objects extends the range of possible applications by allowing electronic functionality on the folded parts. Elastocapillary folding of silicon nitride objects with accurate folding angle v piques. Pour ceux-ci, la fabrication et l'assemblage sont très simples : plongez les ru...

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Measurement of Electrical Resistivity of Nanostructured Platinum Thin Films and Quantum Mechanical Estimates

Cited by 4 publications

References 23 publications

Surface-Induced Electrical Resistivity of Conducting Thin Films

Surface-Induced Electrical Resistivity of Conducting Thin Films

Capillary origami of micro-machined micro-objects: Bi-layer conductive hinges

Elastocapillary self-folding of micro-machined structures

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