Measurement of Deformation of Epoxy Resin Plates with an Embedded SMA Wire Using Digital Image Correlation

Abstract

The deformation of the surface of epoxy resin plates with an embedded linear shape-memory alloy (SMA) wire as an actuator in smart structure members is measured as a function of the duration of the supply of electric current to the SMA wire, using a digital image correlation technique. Results show that the two-dimensional deformation of the plate surface can be measured, and that the maximum deformation of the plate surface can be obtained on both sides of a crack and increases with the duration of the current supply. Therefore, the deformation of the plate surface measured using the digital image correlation technique suggests the possibility of its application in the prediction of crack closure in epoxy resin plates with embedded SMA wires heated by supplying electric current.

In-Plane Displacement Measurement Using Digital Image Correlation with Lens Distortion Correction

“…In addition, unlike other methods which utilize the interference of light waves, phase analysis of the fringe pattern and the subsequent phase unwrapping process are not required. Thus, many applications of this method to various problems can be found, such as in studies of high-temperature deformation measurement (9) , dynamic crack propagation (10) , shape memory alloy (11), (12) , time-dependent materials (13) , and inverse stress analysis (14) . In addition to the simplicity of measurements, the recent progress of high-resolution handy digital cameras with zoom lenses has made effective use of the method to various applications.…”

Local Strain Distribution Arising in Shape Memory Alloy Composite Subjected to Thermal Loading

“…[1][2][3][4][5][6][7] In the recent years, some researchers have studied about shape memory alloy composite (SMAC) which consists of SMA reinforcement and polymer or metal matrix. [8][9][10][11][12][13][14][15][16][17][18][19][20][21][22] Especially, considerable attention has been paid to the creating of internal stress in matrix under thermal loading. [8][9][10][11] On the other hand, SMAC exhibits deformation of composite under thermal loading.…”

“…14,19,20) In the case of controlling both of internal stress and deformation, it is important to study about their thermo-mechanical behavior from the viewpoint of analysis and experiment. Umezaki et al 21) tried to measure the distribution of deformation on the surface of SMAC during thermal loading. Ro et al 22) analytically investigated temperature distribution arising in SMAC during thermal loading.…”