2009
DOI: 10.1364/ao.48.006432
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Measurement of buried undercut structures in microfluidic devices by laser fluorescent confocal microscopy

Abstract: Measuring buried, undercut microstructures is a challenging task in metrology. These structures are usually characterized by measuring their cross sections after physically cutting the samples. This method is destructive and the obtained information is incomplete. The distortion due to cutting also affects the measurement accuracy. In this paper, we first apply the laser fluorescent confocal microscopy and intensity differentiation algorithm to obtain the complete three-dimensional profile of the buried, under… Show more

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Cited by 3 publications
(3 citation statements)
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“…The patterned surface and the PDMS cover layer were treated for 30 s at the power of 100 W oxygen plasma, and then were immediately joined together. In order to strengthen the bonding quality, the sample was placed into an oven for 15 min at 80 • C. 15 The detailed bonding parameters are listed in Table 1.…”
Section: Inspection For Plasma Bondingmentioning
confidence: 99%
“…The patterned surface and the PDMS cover layer were treated for 30 s at the power of 100 W oxygen plasma, and then were immediately joined together. In order to strengthen the bonding quality, the sample was placed into an oven for 15 min at 80 • C. 15 The detailed bonding parameters are listed in Table 1.…”
Section: Inspection For Plasma Bondingmentioning
confidence: 99%
“…One challenge all techniques face is the limiting effect of optical distortion caused by the microfluidic device features on quantitative accuracy of the measurement. The microfluidic device‘s interfaces introduce spherical aberration and affect the effective depth to which the beam(s) focuses, the confocal volume changes as a function of depth, and a reduced collection efficiency often results, leading to “dark” or “hidden” regions within the image. Curved surfaces can additionally introduce lensing effects. The specific relationship between channel position and optical aberration depends on the channel depth, the numerical aperture of the illumination/collection optics, the refractive indices of the chip material and the fluid, and the shape of the interface (Figure a), making quantitative measurements difficult.…”
mentioning
confidence: 99%
“…(TD220, Tektronix, USA) was used for collecting the electrical signal and converts it to a waveform, which was subsequently transferred to the PC via the serial interface. The channel dimension after bonding was measured with a confocal microscopy system [193]. The confocal microscopy is an optical imaging technique that can measure embedded micro-features bonded to a cover layer.…”
Section: Methodsmentioning
confidence: 99%