Measurement and Modeling of MEMS

Abstract

Advances in MEMS, also called microsystems, require the use of computational modeling and simulation with physical measurements, i.e., measurements and modeling (M&M) approach is needed. We believe that successful combination of computer aided design (CAD) and multiphysics/multiscale simulation tools with the state-of-the-art (SOTA) measurement methodology will contribute to reduction of high prototyping costs, minimization of long product development cycles as well as time-to-market pressures while developing MEMS for various applications. In our approach we combine a unique, fully integrated, software environment for multiscale, multiphysics, high fidelity analyses of MEMS with the SOTA optoelectronic laser interferometric microscope (OELIM) methodology. The OELIM methodology allows remote, noninvasive, full-field-of-view measurements of deformations with very high spatial resolution, nanometer accuracy, and in near real-time. In this paper, both, the software environment and the OELIM methodology are described and their applications are illustrated with representative results demonstrating viability of the M&M approach to the development of MEMS. These preliminary results demonstrate capability of the M&M approach to quantitatively determine effects that static and dynamic loads have on the performance of MEMS.