Measurement and characterization of backplanes for serial links operating at 56 Gbps

Beyene, W.T.; Hahm, Yeon-Chang; Secker, D.; Mullen, Don; Mayandi, Narayanan

doi:10.1109/ectc.2015.7159638

Cited by 7 publications

(2 citation statements)

References 1 publication

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“…We will consider for transmitter a digital non-return to zero signal type (NRZ). Another signaling option for high speed is multi-level pulse amplitude modulation (PAM) scheme for optimized interconnects as in the chip-to-chip applications, or backplanes [ 2 , 3 ]. For these variants the length will vary from few centimeters to one meter that will need to support high enough data rates.…”

Section: Introductionmentioning

confidence: 99%

Passive Equalization Networks—Efficient Synthesis Approach for High-Speed Signal Integrity Characterization

Brinaru

2021

Sensors

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High data rates challenges and long traces from current state-of-the-art systems imply high attenuation. In the present article, we will present a detailed process of synthesis of equalizers, for choosing the correct one for a given application. The methods are based on scattering parameters applied on interconnections modeled as microstrip or stripline. Firstly, one may have an overview of types of equalizers, passive, active, and adaptive ones, and a detailed filter synthesis is applied in microwave systems having as start point the insertion loss of a given trace on a given substrate. Next, time domain analyses offer a better understanding of the performance of the interconnect, based on eye diagram inspection and the variation of waveforms with time. Finally, we will present results based on simulation of the equalizers network in a microstrip technology followed by discussions and conclusions. The study proposes to use equalizers in either the transmitter or receiver point, proposes a bridge equalizer with the cost of additional elements but improved constant input, output impedance, and also a new variant for single ended trace based on microwave resonator is proposed. Performance is demonstrated by results from simulations.

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Section: Introductionmentioning

confidence: 99%

Passive Equalization Networks—Efficient Synthesis Approach for High-Speed Signal Integrity Characterization

Brinaru

2021

Sensors

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“…In response, a variety of techniques have been developed, including using back drilling to reduce stub length and placing the glass cloth at an oblique angle to reduce unevenness, etc. [4][5][6][7] However, these techniques are neither sufficient to completely eliminate the via stub, nor the skew between the differential wiring. Therefore, with the aim of realizing a transmission configuration that is both stub-less and skew-free, we developed a novel transmission configuration, whereby a flexible printed circuit (FPC) dedicated to high-speed transmission was created and connected with the PKG by a solder bump (Fig.…”

Section: Introductionmentioning

confidence: 99%

Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate

Akahoshi

Mizutani

Sugimoto

et al. 2018

Transactions of The Japan Institute of Electronics Packaging

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To meet the demand for higher signal transmission speeds, we investigated an interconnect structure using a flexible printed circuit (FPC), and clarified that this facilitated major improvements in the signal integrity. A differential transmission line with a stripline structure was created within the FPC, and by connecting this with the IC packages (PKG) via solder bumps, a stub-less, skew-free interconnect configuration was realized. We evaluated 14 Gbps to 56 Gbps electrical characteristics with a prototype module, and verified that this facilitated a 30% to 60% extension of transmission length compared to a conventional printed circuit board (PCB).

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What Is an Electrical Connector?

Pecht

Kyeong

2020

Electrical Connectors

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Measurement and characterization of backplanes for serial links operating at 56 Gbps

Cited by 7 publications

References 1 publication

Passive Equalization Networks—Efficient Synthesis Approach for High-Speed Signal Integrity Characterization

Passive Equalization Networks—Efficient Synthesis Approach for High-Speed Signal Integrity Characterization

Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate

What Is an Electrical Connector?

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