Mathematical Modeling of the Limiting Current Density from Diffusion-Reaction Systems

Abstract

The limiting current density is one of to the most important indicators in electroplating for the maximal current density from which a metal can be deposited effectively from an electrolyte. Hence, it is an indicator of the maximal deposition speed and the homogeneity of the thickness of the deposited metal layer. For these reasons, a major interest in the limiting current density is given in practical applications. Usually, the limiting current density is determined via measurements. In this article, a simple model to compute the limiting current density is presented, basing on a system of diffusion–reaction equations in one spatial dimension. Although the model formulations need many assumptions, it is of special interest for screenings, as well as for comparative work, and could easily be adjusted to measurements.

Side Chain Crosslinked Anion Exchange Membrane for Acid Concentration by Electrodialysis

“…The I – V curves reveal that as IEC increases so does LCD for QPAB- x membranes. The magnitude of LCD also depends on solution concentration; higher concentrations generally result in an increased LCD. − The LCD tested in 0.2 mol L –1 sulfuric acid solution (Figure S3) is obviously higher than that of 0.1 mol L –1 sulfuric acid solution. Furthermore, area resistance was calculated based on I – V curves obtained in a 0.1 mol L –1 sulfuric acid system (Figure f).…”