Mathematical Description of Nano Indentation Unloading Curve of Ceramic Materials and Test Method of Film Thickness

Abstract

The indentation unloading curve of ceramic materials describes the contact position and thickness between solid film and substrate. Ceramic films are widely used in modern industry, national defense, military and electronic devices. They have the advantages of low density, high specific strength, high temperature resistance and good oxidation resistance. The film thickness is one of the important parameters reflecting the preparation process. It will not only affect the material itself, but also damage the adjacent surface. Therefore, the mechanical properties should be improved by controlling the pressure applied to the substrate interface. Based on the preparation process, this paper introduces the nano indentation unloading curve test of ceramic thin-layer samples by indentation method, studies the changes of material properties and mechanical properties under different thickness and temperature, and describes the microstructure of ceramic thin-film and analyzes its compactness and microstructure by load displacement curve. After a series of experimental tests, the mathematical description of nano indentation unloading curve of ceramic materials and the method of film thickness measurement are summarized. 1.IntroductionCeramic materials play an important role in modern science and technology and are closely related to people's daily life. Metal film has been widely used in various fields because of its excellent performance, and the indentation problem affects whether the whole industrial application field can realize energy conservation, environmental protection, energy conservation, resource conservation and so on. Ceramic materials have excellent properties such as low density, high hardness, high temperature resistance, easy molding and strong corrosion resistance. It is essential to measure and test the thickness of metal film in practical industrial production.Many scholars have studied the nano indentation unloading curve and film thickness