Mathematical and numerical correction of the DIC displacements for determination of stress field along crack front

Chernyatin, A. S.; Matvienko, Yu. G.; López-Crespo, P.

doi:10.1016/j.prostr.2016.06.331

Cited by 7 publications

(3 citation statements)

References 35 publications

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“…3a that results are not in accordance with thermal contraction phenomenon (contraction towards center). This discrepancy is due to presence of rigid body motion (RBM) [11] (translation and / or rotation). RBM is the pure translation or rotation of the sample that does not result from any deformation of the sample.…”

Section: Ss304 Disc (Tablementioning

confidence: 99%

Full-Field Displacement Measurement Method of Metal-As-Insulation Pancake at Liquid Nitrogen Temperature

Alharake

Fazilleau

Godfrin

et al. 2022

IEEE Trans. Appl. Supercond.

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In situ measurement of metal-as-insulation (MI) high temperature superconductor (HTS) pancake deformation gives insight to its actual mechanical state. Measurement of hoop strain for inner / outer turn of MI pancake is usually made by strain gauges. This measurement is however local and faces electromagnetic compatibility (EMC) and thermal issues. Non-contact full-field displacement measurement is an interesting alternative solution. This technique is based on digital image correlation (DIC), which derives the displacement field in specified region of interest (ROI) by correlation between the deformed state image and the reference state image.

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Section: Ss304 Disc (Tablementioning

confidence: 99%

Full-Field Displacement Measurement Method of Metal-As-Insulation Pancake at Liquid Nitrogen Temperature

Alharake

Fazilleau

Godfrin

et al. 2022

IEEE Trans. Appl. Supercond.

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“…These studies performed correlation for continuous displacement fields but did not provide information regarding the discontinuous edges associated with the cracks. Chernyatin et al [24] developed a mathematical and numerical correction method for displacements determined by DIC. The proposed model provides a theoretical description of the discontinuous displacement fields associated with material edges.…”

Section: Introductionmentioning

confidence: 99%

The Use of Surface Topography for the Identification of Discontinuous Displacements Due to Cracks

Uzun

Korsunsky

2020

Metals

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The determination of three components of displacements at material surfaces is possible using surface topography information of undeformed (reference) and deformed states. The height digital image correlation (hDIC) technique was developed and demonstrated to achieve micro-level in-plane resolution and nanoscale out-of-plane precision. However, in the original formulation hDIC and other topography-based correlation techniques perform well in the determination of continuous displacements. In the present study of material deformation up to cracking and filan failure, the ability to identify discontinuous triaxial displacements at emerging discontinuities is important. For this purpose, a new method reported herein was developed based on the hDIC technique. The hDIC solution procedure comprises two stages, namely, integer-pixel level correlation and sub-pixel level correlation. In order to predict the displacement and height changes in discontinuous regions, a smoothing stage was inserted between the two main stages. The proposed method determines accurately the discontinuous edges, and the out-of-plane displacements become sharply resolved without any further intervention in the algorithm function. High computational demand required to determine discontinuous displacements using high density topography data was tackled by employing the graphics processing unit (GPU) parallel computing capability with the paging approach. The hDIC technique with GPU parallel computing implementation was applied for the identification of discontinuous edges in an aluminium alloy dog bone test specimen subjected to tensile testing up to failure.

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“…Considering the application of experimental stress/strain analysis approaches to bonded joints, numerous research projects used Digital Image Correlation (DIC) to measure crack size, crack tip location, and determine adhesives' cohesive properties [27][28][29][30][31][32][33][34][35][36][37].…”

mentioning

confidence: 99%

Experimental analysis of mode I crack propagation in adhesively bonded joints by optical backscatter reflectometry and comparison with digital image correlation

Lima

Perrone

Carboni

et al. 2021

Theoretical and Applied Fracture Mechanics

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Mathematical and numerical correction of the DIC displacements for determination of stress field along crack front

Cited by 7 publications

References 35 publications

Full-Field Displacement Measurement Method of Metal-As-Insulation Pancake at Liquid Nitrogen Temperature

Full-Field Displacement Measurement Method of Metal-As-Insulation Pancake at Liquid Nitrogen Temperature

The Use of Surface Topography for the Identification of Discontinuous Displacements Due to Cracks

Experimental analysis of mode I crack propagation in adhesively bonded joints by optical backscatter reflectometry and comparison with digital image correlation

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