Materials characterization of the effect of mechanical bending on area array package interconnects

Rooney, Dan; Castello, N. Todd; Cibulsky, Mike; Abbott, Doug; Xie, Dongji

doi:10.1016/s0026-2714(03)00193-8

Cited by 28 publications

(14 citation statements)

References 1 publication

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“…Well-packed, orderly films which can be formed on the copper surface, must not only prevent the surface from corrosion but are also expected to support the ultrafine basic requirements anticipated for nano-sized electronic components [3]. The modified surface blocks the approach of electrochemically active species to the electrode surface, resulting in a complete suppression of their redox reactions at the electrode surface.…”

Section: Introductionmentioning

confidence: 99%

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

et al. 2012

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Section: Introductionmentioning

confidence: 99%

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

et al. 2012

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“…Bending tests are useful for evaluating board level assemblies for performance under mechanical stresses. 19) During the bending test, the bending of the package leads to differential bending between the FR-4 substrate and the package that must be accommodated by the deformation of the interconnects. 20) The underfill material can greatly improve the mechanical reliability of BGA assembly due to the stress distribution during the bending test.…”

Section: Mechanical Reliability Propertiesmentioning

confidence: 99%

Bonding Characteristics of Underfilled Ball Grid Array Packaging

Yim

Lee

et al. 2015

Mater. Trans.

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In recent years, ball grid array (BGA) package has been widely used in the portable electronic device, which can offer miniaturization and increased functional density. Thus, the failure chances of package under shock and vibration environments have been increased. In this work, we investigate the effect of underfill properties on bonding characteristics of underfilled BGA packaging. Three kinds of underfill materials with different additive content were formulated. Dynamic mechanical analysis (DMA), tensile test and shear test were conducted to examine the material properties of underfill resin such as the storage modulus (EA), glass transition temperature (T g ), mechanical and adhesion strength. In addition, the three-point bending test was conducted for underfilled BGA assemblies to investigate the mechanical reliability of BGA interconnects. The results indicate that the underfill resin should have a proper T g to ensure the mechanical properties, and modulus of toughness of underfill resin acts as an important factor rather than mechanical strength and EA (Stiffness) to ensure the mechanical reliability of BGA assembly.

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“…And the cyclic bending test also was started, because the use of mobile device has been increased. As a result of previous study, thermal cycling behavior of solder joints was revealed brightly [1][2][3][4] and bending fatigue behavior has been uncovered [5][6][7]. But the relationship between thermal and bending fatigue behavior was not discovered yet.…”

Section: Introductionmentioning

confidence: 96%

Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

Kim

Lee

2007

2007 Proceedings 57th Electronic Components and Technology Conference

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In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the microbending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.OAgO.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb).In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. Furthermore, to certify the crack behavior, the failed specimen was sectioned. In thermal cycling case, crack initiated inner solder joints. But outmost solder failed first in the cyclic bending test.A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

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Materials characterization of the effect of mechanical bending on area array package interconnects

Cited by 28 publications

References 1 publication

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

Bonding Characteristics of Underfilled Ball Grid Array Packaging

Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

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