Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives

Abstract

Three commercially available, silver filled, snap cure isotropically electrically conductive adhesives for surface mount applications were selected for study. Fundamental material characterizations were conducted on these materials, including thermal analysis [differential scanning calorimetry (DSC), thermo-gravitational analysis (TGA), and thermo-mechanical analysis (TMA)], rheological, and dynamic mechanical analyses. Microstructural investigations [scanning electron microscopy (SEM), transverse electromagnetic (TEM), Auger)] were performed to identify the silver flake size, distribution, and contact morphology. These analyses were related to the cure process and electrical conduction mechanisms of isotropically conductive adhesives (ICA's).The resistivity of these materials was monitored during cure and related to the cure kinetics of the epoxy matrix. The resistivity decreased dramatically (>k 1 cm to m 1 cm) around a specific temperature with ramp cure and over a narrow time range (<10 s) with isothermal cure. Successive heating (25-150 C) and cooling cycles yielded different degrees of consecutive resistivity decreases for these materials which were cured according the manufacturer's recommended schedules. Microstructure development during cure was studied with a hot stage in an environmental scanning electron microscope (ESEM) to relate morphological changes with the observed changes in resistance. No significant structural changes and silver flake movements were noticed during cure. The conduction development was accompanied by breakage and decomposition of the tarnish, organic thin layers which cover the silver flake surface, and by the enlargement of the contact area between silver flakes by thermal stress and shrinkage during the epoxy cure. The temperature coefficients of resistance (TCR) were measured for these materials; the TCR is closely related to a conduction mechanism dominated by constraint resistance between the flakes or by the silver flake metallic conduction.The resistivity and interfacial resistance of these materials with bare copper and gold plated pads (with five selected cure schedules) were measured through 85 C/85% RH exposure up to 900 h. The bulk resistivity decreased in the first 100 h of exposure and did not change with humidity; however, the interfacial resistance increased with the copper pads for some materials. This is caused by the oxidation of the copper pads due to moisture attack.

The Dependence on Thermal History of the Electrical Properties of an Epoxy-Based Isotropic Conductive Adhesive

“…7,8 The present authors 8 have previously investigated the effect of curing conditions on the electrical properties of isotropic conductive adhesives (ICAs) composed of an epoxy-based binder, and we found that the electrical resistance of ICA specimens appears to decrease during the curing and cooling processes. The decrease in the electrical resistance is suggested as being caused by shrinkage of the adhesive binder, 9,10 accompanied by accumulation of internal stress. 11,12 The electrical resistivity of the cured ICA tends toward a certain value (which differs depending on the curing temperature) with increasing degree of conversion.…”

Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate

“…1-3 A number of research articles about the electrical properties of metal-filled polymer composites have been reported. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15] It was found that the interface between the metal fillers is one of the major factors that could degrade the electrical property of the polymer composite. 16,17 One of the approaches to minimize the interface is to make these fillers fuse with each other.…”

Stabilizing contact resistance of isotropically conductive adhesives on various metal surfaces by incorporating sacrificial anode materials

“…The ICAs satisfy the requirements for lead-free (green, environmentally friendly) interconnects, and their processing temperature is considerably lower (100-150°C ) than that of eutectic (220-230°C ) or lead-free solders, such as SnAg (96.5%/3.5% by weight, respectively) and SnAgCu (96.1%/3.2%/0.7% by weight, respectively). [1][2][3][4][5][6][7][8][9][10][11][12] Therefore, many efforts have been dedicated to apply ICAs in the board-assembly process as an interconnect material. While ICAs have many advantages over eutectic and lead-free solders, there are some technical challenges to overcome, such as unstable contact resistance under extremely humid conditions, low electrical conductivity, low impact strength, and low self-alignment capability.…”