Material Removal Rate Characteristics in Ultrasonic Aided Lapping of Engineering Ceramics Based on Single-Point Scratch

Abstract

A new ultrasonic aided lapping technology was developed by combining lapping technology and ultrasonic machining technology. The appended special tangential ultrasonic vibration changes the material removal rate (MRR) characteristics. In order to clarify the influence of ultrasonic vibration, in this paper, the MRR models in ultrasonic aided single-point scratch were deduced based on indentation fracture theory. Through contrast scratching and lapping experiments, the MRR characteristics in ultrasonic aided lapping of engineering ceramics were presented. Research result shows that the MMR in ultrasonic aided lapping is larger than that in conventional lapping under the same conditions; with the increase of ultrasonic generator power and lapping pressure, the MMR in lapping increases correspondingly.

Research on Crack Mechanism of Surface/Subsurface Based on Grinding Stress Field in Ultrasonic Grinding Nano-Ceramics

“…Therefore, grinding crack is a sort of grinding damage of most serious harmfulness, and it is an important parameter for ceramic surface quality assessment. However, because of the brittle characteristics and the characteristics of the micro-structure of ceramics, studies of ceramic crack mechanism mainly have been limited to common processing for a long time [5][6][7][8]. There is less development on the crack mechanism in ultrasonic grinding ceramics, especially for twodimensional ultrasonic grinding [9][10][11].…”