Material removal mechanisms in precision machining of new materials

Deformation and material removal in a nanoscale multi-layer thin film solar panel using nanoscratch

“…For all indenters, a negative rake angle of the indenter face was required to induce plastic deformation ahead of the tip by increasing compressive stress [14,16]. In addition, the geometry has been described as the key parameter in determining the critical depth for ductile mode cutting [10,11,13,14], as well as material removal mechanisms [7,12,14,15,25]. The plots of scratch load vs. depth in Fig.…”

“…Nevertheless, the previous research had also demonstrated that fracture mode removal could transit into ductile mode through ultra-precision processes where the grinding parameters and abrasive wheel geometry were precisely controlled, so the grit depth of cut used for cutting was below a critical value [10,11]. Under such conditions, deformation was confined to the plastic zone, and material removal occurred in the ''ductile regime'', which prevented crack formation and surface damage [6][7][8][12][13][14][15]. With this understanding, ultra-precision grinding was successfully used to produce smooth surfaces of surface roughness in nanometer scale in materials such as glass, silicon, germanium, cemented carbides and other ceramics [11,[16][17][18][19][20].…”

Modern Manufacturing Processes: A Review

“…This process is termed as "ductile regime machining". Ductile regime machining follows from the fact that all materials will deform plastically if the scale of deformation is very small [5].…”

The use of reliability in the Taguchi method for the optimisation of the polishing ceramic gauge block

“…3 Schematic diagram of the polishing machine ratio using Eqs. (12) and (13). Table 5 shows the Weibull modulus and the corresponding S/N ratio.…”

“…They have found that higher polishing speed, higher oscillation frequency of the film and a harder urethane contacting roller would give higher polishing efficiency and better surface roughness. Sreejith and Ngoi (2001) dealt with various material removal mechanisms during precision machining of advanced materials. Free abrasive machined surfaces of materials indicate that materials are removed through microindentations by abrasive particles, which cause lateral cracking.…”