Mass production techniques for optical modules

Kurata, K.

doi:10.1109/ectc.1998.678752

Cited by 11 publications

(2 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The horizontal position was aligned so as to fit alignment marks on the platform and the LD. The alignment marks were detected by monitoring the infrared light passed through the LD and the platform [6,7]. The alignment accuracy was better than 0.5 ptm, and the coupling loss was 3.95 dB.…”

Section: Transmitter Portmentioning

confidence: 99%

A Small and Low Cost Bidirectional Transceiver Module with Polymer Waveguide for G-PON/GE-PON

Sugimoto

Shimizu

Akimoto

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

View full text Add to dashboard Cite

Section: Transmitter Portmentioning

confidence: 99%

A Small and Low Cost Bidirectional Transceiver Module with Polymer Waveguide for G-PON/GE-PON

Sugimoto

Shimizu

Akimoto

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

View full text Add to dashboard Cite

“…Research work has led to the demonstration and utilization of planar lightwave circuits (PLCs) [6]- [8]. However, hybrid integration also seems to offer a very competitive solution for optical communication modules [9]- [11]. In some module realizations, such as high-power optical transmitter modules needed in sensor and tooling applications, hybrid integration seems to be the only realistic method [12].…”

mentioning

confidence: 98%

Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate

Keränen

Mäkinen

Kautio

et al. 2006

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

A concept that utilizes structured planar substrates based on low-temperature cofired ceramics (LTCC) as a precision platform for a miniature passive alignment multimode laser module is demonstrated. The three-dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves, and cavities for the laser-to-fiber coupling. The achieved passive alignment accuracy allows high coupling efficiency realizations of multimode fiber pigtailed laser modules. Thick-film printing and via punching can be incorporated in order to integrate electronic assemblies directly on the optomechanical platform. The platform is scalable, and it allows embedding of subsystems, such as silicon optical bench (SiOB), but it also provides the interface for larger optical systems. Temperature management of high-power laser diodes is achieved by realizing heat dissipation structures and a cooling channel into the LTCC substrate. The measured maximum laser metallization temperature was 70 C when a thermal power of 0.5 W was applied at the laser active area using a liquid cooling of 50 mL/min. The measured maximum temperature of the laser surface was about three times higher without liquid cooling. Optical coupling efficiency of the multimode laser systems was simulated using optical systems simulation software. The nominal coupling efficiency between 100 1 m stripe laser and 62.5/125-m graded index fiber (NA = 0.275) was 0.37. The simulated coupling efficiency and alignment tolerances were verified by prototype realization and characterization. The measured alignment tolerance values between laser and fiber in AT prototype series were 1 = 7.7 m, 1 = 7.6 m, and 1 = 10.8 m (SD values). The corresponding values in A2 prototype series were 1 = 3.1 m, 1 = 9.1 m, and 1 = 10.2 m. The measured average coupling efficiency was 0.28 in AT series and 0.31 in A2 series. The coupling efficiencies of all operational prototypes varied from 0.05 to 0.43.

show abstract