Mask inspection system with variable sensitivity and printability verification function

Abstract

We report on the development of a new mask inspection technology that makes total inspection faster and less costly. The new technology adopts a method of selecting a defect detection sensitivity level for every local area, defined by factors such as defect judgment algorithm and defect judgment threshold. This approach results in a reduction of pseudodefect count leading to shorter inspection and review time. Selected defect detection sensitivity levels for every local area are extracted from a database of Mask Data Rank (MDR) that is based on the design intent from the design stage, and/or on a pre-analysis of inspection pattern data. The proposed system also executes a printability verification function, not only for the mask defect regions but also for specific portions where high Mask Error Enhancement Factor (MEEF) is determined. It is necessary to ascertain suppression of pseudo-defect detection for extremely complicated masks such as masks with Source-Mask Optimization (SMO). This work reports on the new mask inspection system.

Computational lithography: Exhausting the resolution limits of 193-nm projection lithography systems

“…Recent efforts in computation have introduced so-called "wafer plane" inspection, [96][97][98][99][100] which accounts for some of the recent improvements. Recent efforts in computation have introduced so-called "wafer plane" inspection, [96][97][98][99][100] which accounts for some of the recent improvements.…”