Manufacturing Tolerance Analysis, Fabrication, and Characterization of 3-D Submillimeter-Wave Electromagnetic-Bandgap Crystals

Martínez, B.; Ederra, I.; Gonzalo, R.; Alderman, Byron; Azcona, L.; Huggard, P. G.; Hon, Bas de; Hussain, Aftab M.; Andrews, S. R.; Marchand, L.; Maagt, P. de

doi:10.1109/tmtt.2007.892803

Cited by 31 publications

(29 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Despite the advancements of THz EBG components and applications, one of the major challenges remaining to be overcome involves the practical difficulties in component fabrication (especially at integrated micro-system level), as the feature dimensions of THz EBG components fall in a transition region between the conventional machining techniques used for microwave applications and the micro/nano fabrication methods in use at optical frequencies [20]. Several semiconductor fabrication approaches for THz components, including dicing saw machining [21], wet etching [22], deep reactive iron etching (DRIE) [23], deep X-ray lithography [24] and laser micromachining [20,24], have been reported.…”

Section: Conventional Fabrication Methodsmentioning

confidence: 99%

“…Several semiconductor fabrication approaches for THz components, including dicing saw machining [21], wet etching [22], deep reactive iron etching (DRIE) [23], deep X-ray lithography [24] and laser micromachining [20,24], have been reported. These methods are usually expensive, and require extraordinary care to achieve even relatively uniform THz EBG geometries, let alone the more complicated structures such as defect cavities and waveguides.…”

Section: Conventional Fabrication Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Investigation of several terahertz electromagnetic band gap structures

Young

Gehm

et al. 2010

Micro & Optical Tech Letters

View full text Add to dashboard Cite

show abstract

Section: Conventional Fabrication Methodsmentioning

confidence: 99%

Section: Conventional Fabrication Methodsmentioning

confidence: 99%

Investigation of several terahertz electromagnetic band gap structures

Young

Gehm

et al. 2010

Micro & Optical Tech Letters

View full text Add to dashboard Cite

show abstract

“…To verify our design and the fabrication process, a silicon WPS with the aforementioned dimensions was fabricated using a simple but robust mechanical layer-by-layer dicing process [50], [51]. A series of grooves were cut into both the front and back faces of a silicon wafer (with a resistivity of Ohm-cm) by using a diamond dicing saw.…”

Section: Fabrication and Characterization Of The Silicon Wpsmentioning

confidence: 99%

THz thermal radiation enhancement using electromagnetic crystals

Xin

Young

et al. 2007

2007 IEEE Antennas and Propagation Society International Symposium

View full text Add to dashboard Cite

Abstract-Thermal radiation in the terahertz (THz) range only occupies a tiny portion of the whole blackbody power spectrum at room temperature. We demonstrate that a thermal radiator, which is constructed from an electromagnetic (EM) crystal, can be designed so that its photon density of states (DOS) is enhanced in the THz frequency range. We also demonstrate, as a consequence, that this source may lead to large enhancements of the radiated power over the values associated with normal blackbody radiation at those frequencies. The THz thermal radiation enhancement effects of various EM crystals, including both silicon and tungsten woodpile structures and a cubic photonic cavity (CPC) array, are explored. The DOS of the woodpile structures and the CPC array are calculated, and their thermal radiation intensities are predicted numerically. These simulations show that the radiated power can be enhanced by a factor of 11.8 around 364 GHz and 2.6 around 406 GHz, respectively, for the silicon and tungsten woodpile structures in comparison to the normal blackbody radiation values at those frequencies. It is also shown that an enhancement factor of more than 100 may be obtained by using the CPC array. A silicon woodpile EM crystal with a band gap around 200 GHz was designed and fabricated. The transmission property of this woodpile structure was verified using the THz time-domain spectroscopy (TDS). Thermal emissions from the fabricated silicon woodpile and a control blackbody sample were measured. Enhancements of the woodpile source radiation over the blackbody were observed at several frequencies which are consistent with the theoretical predictions.

show abstract

“…Among the advantages that lead to its popularity are its large bandwidth, robustness and relative simple fabrication. As a matter of fact, prototypes have been realized from the microwave and millimeter ranges up to optical frequencies [5][6][7][8][9][10] for applications such as antennas [11][12][13], millimeter wave components [14][15][16] or optical communications [17][18][19].…”

Section: Introductionmentioning

confidence: 99%