2015
DOI: 10.1134/s1063739715030087
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Manufacturing technology of intra- and interchip interconnects for modern ULSIs: Review and concepts of development

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Cited by 12 publications
(2 citation statements)
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“…Nowadays, exploring polyimide (PI) with high-performance low-k properties has received great enthusiasms due to its high thermal stability, mechanical properties, and chemical inertness. [1][2][3][4] PI has been used as interconnect dielectrics for over half a century due to its high thermal stability, mechanical properties, and chemical inertness. [5][6][7] However, commercialized PI products such as Kapton H, Upilex-S, ULTEM 1000 present high dielectric constant with the values of 3.1-3.5.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, exploring polyimide (PI) with high-performance low-k properties has received great enthusiasms due to its high thermal stability, mechanical properties, and chemical inertness. [1][2][3][4] PI has been used as interconnect dielectrics for over half a century due to its high thermal stability, mechanical properties, and chemical inertness. [5][6][7] However, commercialized PI products such as Kapton H, Upilex-S, ULTEM 1000 present high dielectric constant with the values of 3.1-3.5.…”
Section: Introductionmentioning
confidence: 99%
“…
Nowadays, the increasing amounts of data generated in various fields of human activity lead to new challenges for computing, chip-to-chip interconnect, telecom, and storage devices. [1] These challenges include not only the requirements for operation frequency, speed, and computation bandwidth, but also for effective power consumption. [2,3] Integrated photonics promise several approaches to solve problems arising in optical communication systems, [4,5] parallel, [6] and quantum [7,8] computing.
…”
mentioning
confidence: 99%