Manufacturing semiconductor integrated circuits with built-in hermetic equivalent reliability

Loboda, Mark J.; Camilletti, R.; Goodman, L.A.; White, L.; Pinch, H.L.; Wu, C. P.

doi:10.1109/ectc.1996.550752

Cited by 5 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…All of these approaches apply the coatings after the IC assembly processes, which requires each assembly site to acquire equipment and expertise in pristine cleaning and coating technologies. Alternate processes have been recently developed [8] to apply hermetic-equivalent coatings at the wafer level, allowing IC fabricators or wafer processing centers to offer bare die with the hermetic coatings already in place. Such devices with dual inorganic layers of silicon oxide and silicon carbide, Dow Corning's ChipSealTM Hermetic Coating materials, were evaluated in this program.…”

Section: Introduction Backgroundmentioning

confidence: 99%

Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

Conway

Hagge²

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)

View full text Add to dashboard Cite

This paper presents the results of comparative testing of standard encapsulants versus inorganic hermeticequivalent protective coatings in a full factorial study that also compares wire-bond assembly versus flip-chip assembly, and supplemental encapsulant/underjlI die protections versus no encapsulant/underJilI protection. The Demonstration MultiChip Modules (MCMs) included two design versions, flip-chip and wire-bond, of a General Aviation Data Accumulator MCM. Full wafer probe testing was performed both before and afer the supplemental ChipSeal TMprocessing and flip-chip wafer bump processing steps. ChipSeal mandflip-chip wafer processing steps were shown to cause no yield degradation on the two different wafers types used in the MCMs. Known-Good-Die (KGD) screening of all integrated circuits in the modules was utilized to keep infant mortality failures out of the reliability test results. Preliminary substrate reliability investigations determined that laminate materials BT and Polyimide are suitable for robust MCM-L applications.Reliability testing includes vibration in step-stress exposures j-om 2 to 44 g(rms), thermal cycling for 2000 cycles j-om -55 to 4-125 "c, 85 W85% RH high humidity testing accelerated by pre-conditioning and power cycling, and 130 "c bias Highly Accelerated Stress Testing (HAST). Comparative reliability results will be presented on identical circuit designs in flip-chip versus wire-bonded assemblies, with and without the protective inorganic coatings, and with and without organic encapsulant/underj?ll protection.

show abstract

Section: Introduction Backgroundmentioning

confidence: 99%