Manipulating thermal resistance at the solid–fluid interface through monolayer deposition

Hasan, Mohammad Rashedul; Vo, Truong Quoc; Kim, BoHung

doi:10.1039/c8ra08390h

Cited by 26 publications

(22 citation statements)

References 57 publications

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“…The minor pressure losses due to sudden extraction or contraction occurred in the cooling channel can be calculated by using Equations (20) and (21), respectively [26]:…”

Section: Friction Coefficient and Pressure Drop Analysismentioning

confidence: 99%

“…The minor pressure losses occurred due to 90 • bending at the inlet and outlet pipe regions. These can be calculated by using Equation (24), where K b,j is the bending loss coefficient which can be assumed as a constant value of 1.2 [21]:…”

Section: Friction Coefficient and Pressure Drop Analysismentioning

confidence: 99%

“…Nevertheless, extended surfaces heat sinks are usually insufficient to provide enough cooling rates for the high-power LEDs. Other less common thermal management methods such as microjet cold plates [13,14], thermoelectric refrigeration [15], liquid metal cooling of cold plates [16], porous media micro cooling blocks [17], heat pipe applications [18], ferrofluid coolant [19], electric field control [20], and monolayer applications [21] have been published in the current literature. Liquid cooling blocks present an effective cooling alternative for the LED's cooling as well as other cooling applications on electronic devices, batteries, etc.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Kılıç

Aktaş²,

Sevilgen

2020

Energies

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This research work presents a comparative thermal performance assessment of the laminar flow cooling blocks produced for automotive headlight assembly using a high power Light Emitting Diode (LED) chip. A three-dimensional numerical model with conjugate heat transfer in solid and fluid domains was used. Laminar flow was considered in the present analysis. The validation of the numerical model was realized by using the measured data from the test rig. It was observed that substantial temperature variations were occurred around the LED chip owing to volumetric heat generation. The cooling board with lower height performs better thermal performance but higher pressure drop for the same mass flow rates. The cooling board with the finned cover plate performs better thermal performance but results in an increased pressure drop for the same mass flow rates. Increasing the power of the LED results in higher temperature values for the same mass flow rates. The junction temperature is highly dependent on the mass flow rates and LED power. It can be controlled by means of the mass flow rate of the coolant fluid. New Nusselt number correlations are proposed for laminar flow mini-channel liquid cooling block applications.

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“…The minor pressure losses due to sudden extraction or contraction occurred in the cooling channel can be calculated by using Equations (20) and (21), respectively [26]:…”

Section: Friction Coefficient and Pressure Drop Analysismentioning

confidence: 99%

Section: Friction Coefficient and Pressure Drop Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Kılıç

Aktaş²,

Sevilgen

2020

Energies

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“…Similar type systems have been used to investigate heat and mass transport characteristics in the solid−liquid interface regions. 15,16,18,35,36 NVE simulations were followed for 2 ns to equilibrate the systems. To simulate the systems at different temperatures, the equilibrated systems were cooled/heated at a rate of 10 K/ns in the NPT ensemble.…”

Section: Molecular Model and Molecularmentioning

confidence: 99%

Thermal Energy Transport across the Interface between Phase Change Material n-Heneicosane in Solid and Liquid Phases and Few-Layer Graphene

et al. 2019

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Molecular dynamics simulations have been performed to investigate the mechanism of thermal energy transport at the interface between n-heneicosane in solid and liquid phases and few-layer graphene at different temperatures under two heating modes (in the "heat-matrix" mode, heat is flowing from the heated heneicosane molecules to the cooled ones through the graphene layers and in the "heat-graphene" mode, the energy is flowing from the heated graphene to the cooled heneicosane). The effect of orientation of the perfect crystal structure (heneicosane molecules are positioned perpendicular and parallel to the graphene basal plane) on the interfacial thermal conductance has been examined. It is observed that the interfacial thermal conductance is 2 orders of magnitude higher under the heat-matrix mode than under the heat-graphene mode, for liquid or solid heneicosane and monolayer graphene. With an increase in the number of graphene layers, the interfacial thermal conductance under the heat-matrix mode decreases and reaches a plateau when the number of the graphene layer is more than eight. This is caused by the decreasing contribution of direct heat transfer from the matrix to matrix across the graphene layers via nonbonded intermolecular interactions. The interfacial thermal conductance becomes similar for both heating modes, once the number of graphene layers in the system is over 15. The influence of temperature on the interfacial thermal conductance is found to be insignificant in the range (175−250 K; 350−400 K). Both the phase and structure of heneicosane significantly influence the interfacial conductance. Spectral analysis suggests that graphene vibrational modes of all frequencies contribute to the interfacial heat transfer.

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“…In addition, MD allows us to investigate and elucidate the microscopic properties that cannot be observed by laboratory experiments [1]. The advantages of MD have been demonstrated as it has been used for many applications, such as nanoscale thermal management [5], nanofluidics [6], nano-machining processes [7], etc.…”

Section: Introductionmentioning

confidence: 99%

Effect of Domain Size, Boundary, and Loading Conditions on Mechanical Properties of Amorphous Silica: A Reactive Molecular Dynamics Study

Reeder

Damone

et al. 2019

Nanomaterials

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Mechanical properties are very important when choosing a material for a specific application. They help to determine the range of usefulness of a material, establish the service life, and classify and identify materials. The size effect on mechanical properties has been well established numerically and experimentally. However, the role of the size effect combined with boundary and loading conditions on mechanical properties remains unknown. In this paper, by using molecular dynamics (MD) simulations with the state-of-the-art ReaxFF force field, we study mechanical properties of amorphous silica (e.g., Young’s modulus, Poisson’s ratio) as a function of domain size, full-/semi-periodic boundary condition, and tensile/compressive loading. We found that the domain-size effect on Young’s modulus and Poisson’s ratio is much more significant in semi-periodic domains compared to full-periodic domains. The results, for the first time, revealed the bimodular and anisotropic nature of amorphous silica at the atomic level. We also defined a “safe zone” regarding the domain size, where the bulk properties of amorphous silica can be reproducible, while the computational cost and accuracy are in balance.

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Manipulating thermal resistance at the solid–fluid interface through monolayer deposition

Abstract: At the interface between monolayer coated solid substrate and fluid, the effect of interfacial mismatch on Kapitza length due to the monolayer particles has been extensively analyzed through a series of non-equilibrium molecular dynamics simulation.

Cited by 26 publications

References 57 publications

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Thermal Energy Transport across the Interface between Phase Change Material n-Heneicosane in Solid and Liquid Phases and Few-Layer Graphene

Effect of Domain Size, Boundary, and Loading Conditions on Mechanical Properties of Amorphous Silica: A Reactive Molecular Dynamics Study

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