2015
DOI: 10.4071/isom-2015-thp43
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Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Abstract: This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm × 6.5 mm × 0.1 mm (0.354″ × 0.256″ × 0.004″), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while … Show more

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Cited by 5 publications
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