Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Abstract

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm × 6.5 mm × 0.1 mm (0.354″ × 0.256″ × 0.004″), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.