“…Both methods have the potential for large-scale production, allow for direct coating of the electrocatalyst on the GDL, and provide excellent thickness control and coating uniformity combined with a high specific surface area. More importantly, they are also scalable to very large electrode areas (∼10 4 cm 2 ) , and enable precise control over morphology and porosity. , PVD methods also provide a path forward to efficient integration and compositional tuning of Cu alloy catalysts, including nonthermodynamic equilibrium alloy compositions that are difficult to synthesize and integrate otherwise. , Beyond providing excellent control over coating uniformity, thickness, and composition, physical vapor deposition methods produce less waste and are less labor-intensive than traditional electrodeposition methods, thus making them cost-competitive, despite higher capital costs . Using a microfluidic gas diffusion electrolyzer, we observed that EB-Cu coatings generally provide better performance than the MS-Cu catalyst coatings in terms of current density, selectivity, and energy efficiency, with an optimum thickness of 400 nm where the energy efficiency (i.e., sum over the Faradaic efficiency times theoretical cell potential divided by the applied potential for all eCO 2 RR products; for details, see below) reaches 51% (56.5% for eCO 2 RR and HER combined).…”