Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging

Kim, Dong-Jin; Kim, Minsu

doi:10.1016/j.matchar.2023.112758

Cited by 11 publications

(1 citation statement)

References 44 publications

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“…The damage of the encapsulated structure could have a serious impact on the heat dissipation and performance stability of the heat source [7,8]. Dong et al [9] found that under high temperature conditions, huge stress would cause the cracking of the electronic encapsulated structure sintered without a silver press. Xu et al [10] found that under high temperature conditions, the fatigue life of three-dimensional stacked packaging structures rapidly declines.…”

Section: Introductionmentioning

confidence: 99%

Simulation Study on Temperature and Stress and Deformation on Encapsulated Surfaces under Spray Cooling

Peng,

Niu,

Zhu

et al. 2024

Energies

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Spray cooling is an effective heat dissipation technology and is widely used in the heat dissipation of encapsulated structures, but most of the research has only focused on the heat transfer performance itself and has lacked the analysis of surface stress and deformation. In this paper, a thermal stress coupling model was established under spray conditions, and the influence of spray parameters such as the spray height, spray flow, and nozzle inclination on heat transfer, surface stress, and deformation were studied. The result indicated that the lower the surface temperature, the smaller the stress and deformation. What is more, there was an optimal spray height (15 mm) to achieve the best heat transfer, and the surface stress and deformation were also minimal at the same time which the values were 28.97 MPa and 4.24 × 10−3 mm, respectively. The larger the spray flow rate, the better the heat transfer effect and the smaller the surface stress and deformation. When the spray flow rate was 24.480 L/h, the minimum values of surface stress and deformation were 25.42 MPa and 3.89 × 10−3 mm, respectively. The uniformity of surface stress distribution could be effectively improved with the increase in flow rate. Compared to 10 and 15 degree nozzle inclination, when the nozzle was perpendicular to the cooling surface, the surface stress and deformation were minimal.

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