“…Particularly, the fabricated PSi films/layers via the galvanostatic approach are often produced by the electrochemical etching of silicon in hydrofluoric acid-based electrolyte mixed with some surfactant like ethanol, and the starting silicon wafer is a single crystalline substrate, which would lead to the formation of various pore arrays with nano/microporous silicon features [7][8][9][10][11][12]. Such a wide range of pore sizes and morphologies was reported to be dependent greatly on the electrolyte concentration of fluoride ions, solution pH, the applied anodic current intensity, the use of organic additives, operating temperature, the silicon wafer characteristics (p-type or n-type silicon with crustal orientation) and whether the electrochemical anodization is being conducted in the dark or under the illumination [13,14]. In addition to this, the etching time was found to be the main factor to control and determine the produced pore length (the thickness of PSi layer).…”